Mold Compound Dam Structure for Compact Sensor Package Cavities
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Solution Overview
Problem
The formation of openings on semiconductor dies for sensor packages faces challenges such as package size limitations, die cracking, and contamination due to the use of specialized mold chase tools, which lead to structural integrity issues and performance degradation.
Innovation Solution
The use of non-metallic mold compound dams that circumscribe sensors on semiconductor wafers, featuring cantilevered portions to create cavities for sensor exposure, preventing mold compound intrusion and reducing package size while maintaining structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If specialized mold chase tools are used to form openings on semiconductor dies, then sensor exposure is achieved, but package size increases and die cracking occurs
Solution Approach 1:
The mold compound dam is segmented into a body portion and a cantilevered portion, where the body portion provides structural support and the cantilevered portion extends over the sensor opening. This segmentation allows the dam to prevent mold compound intrusion into the sensor cavity while maintaining a compact package size, eliminating the need for large specialized mold chase tools.
Solution Approach 2:
The mold compound dam acts as an intermediary structure between the mold compound and the sensor. It prevents direct contact between the mold compound and the sensor cavity, thereby protecting the sensor from contamination and preventing die cracking while enabling sensor exposure through the opening.
2Reliability
If specialized mold chase tools are used to form openings on semiconductor dies, then sensor exposure is achieved, but contamination occurs
Solution Approach 1:
The mold compound dam serves as a protective intermediary that blocks mold compound from entering the sensor cavity. The dam's positioning and structure create a physical barrier that prevents contamination of the sensor while still allowing the sensor to be exposed to the external environment through the opening.
Solution Approach 2:
The mold compound dam is formed on the semiconductor die before the mold compound is applied. This preliminary action creates a protective barrier in advance, preventing mold compound from intruding into the sensor cavity during the packaging process and eliminating the need for post-processing cleaning steps.
3Volume of stationary object
If non-metallic mold compound dams are used, then package size is reduced and die cracking is minimized, but manufacturing complexity increases
Solution Approach 1:
The mold compound dam formation process is merged with the existing semiconductor packaging工艺流程. The dam is formed using standard photolithography and etching techniques that are already part of the manufacturing line, integrating the new feature into existing processes rather than requiring separate specialized tooling steps.
Solution Approach 2:
The mold compound dam utilizes parameter changes in the photolithography process, such as adjusting exposure conditions and developing time, to achieve the desired dam structure. By modifying process parameters within existing equipment capabilities, the patent reduces package size without significantly increasing manufacturing complexity.
Data Source
AI summary
In examples, a semiconductor package includes a semiconductor die including a device side having circuitry formed therein and a non-device side opposite the device side. The semiconductor package includes a mold compound dam on the device side, the mold compound dam comprising a non-metallic material. The semiconductor package includes a mold compound on the device side of the semiconductor die and contacting an outer wall of the mold compound dam, the mold compound absent from a cavity defined by the mold compound dam.