Mold Compound Optical Filtering via Passband Shift in Chip Packaging
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Solution Overview
Problem
Existing semiconductor device packaging lacks effective and cost-efficient methods for controlling electromagnetic radiation wavelengths, limiting the performance and efficiency of optical semiconductor devices.
Innovation Solution
Chemically altering mold compounds using ionizing radiation to shift their passband, allowing for selective attenuation of electromagnetic radiation wavelengths, thereby enhancing the performance of semiconductor devices while reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pigments are incorporated into packaging materials or optical coatings are applied to control electromagnetic radiation wavelengths, then optical filtering capability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent applies ionizing radiation to chemically alter the mold compound, changing its optical properties and absorption spectrum. This parameter change enables the mold compound to attenuate specific wavelength ranges of electromagnetic radiation, providing optical filtering capability without requiring additional pigments or coating layers.
Solution Approach 2:
The patent extracts the optical filtering function from separate components (pigments or optical coatings) and integrates it directly into the mold compound material itself. By chemically altering the mold compound to provide the filtering capability, the design eliminates the need for additional filtering layers or materials.
2Reliability
If pigments are incorporated into packaging materials or optical coatings are applied to control electromagnetic radiation wavelengths, then optical filtering capability is improved, but manufacturing cost increases
Solution Approach 1:
The patent combines the mold compound's primary function (packaging and protection) with the optical filtering function into a single integrated material. By chemically altering the mold compound to provide wavelength-selective attenuation, the design merges structural and optical filtering roles, eliminating the need for separate filtering components.
Solution Approach 2:
The patent uses ionizing radiation to fundamentally change the chemical structure and optical properties of the mold compound, enabling it to selectively attenuate electromagnetic radiation. This parameter change transforms a standard packaging material into a multifunctional material that provides both mechanical protection and optical filtering.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method provides semiconductor devices with improved optical filtering capabilities, achieving high performance at lower costs compared to traditional methods, and is scalable for integration into existing manufacturing processes.
Implementation Method 1
chemically altering the mold compound to attenuate electromagnetic radiation within a range of wavelengths or frequencies
Implementation Method 2
the mold compound is chemically altered to attenuate propagation of electromagnetic energy within a range of wavelengths or frequencies through the chemically-altered mold compound overlying the circuitry
Data Source
AI summary
An example electronic device including a semiconductor die and a mold compound overlying the die, and the mold compound is chemically altered to attenuate electromagnetic radiation within a range of wavelengths or frequencies.