Semiconductor Package Mold Compound With Embedded Thermal Vias
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Solution Overview
Problem
Semiconductor packages face challenges in heat dissipation due to the limited thermal conductivity of conventional mold compounds and the bulkiness and cost of metal lids, which hinder efficient heat expulsion.
Innovation Solution
A semiconductor package design that enhances thermal conductivity by using laser-ablated mold compound orifices filled with thermally conductive materials, eliminating the need for bulky lids and expensive fillers, and incorporating conductive vias and members for efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional mold compound is used, then manufacturing cost is low and ease of manufacture is maintained, but thermal conductivity is insufficient leading to poor heat dissipation
Solution Approach 1:
The patent divides the mold compound into multiple segments by creating conductive vias that extend through different layers. These vias segment the thermal conduction path into multiple parallel channels, allowing heat to dissipate through multiple routes simultaneously, thereby improving overall thermal conductivity without requiring a complete replacement of the mold compound material.
Solution Approach 2:
The patent creates a composite structure by combining the conventional mold compound with conductive materials filled into the vias. This composite approach allows the base mold compound to maintain its manufacturing advantages while the embedded conductive materials provide enhanced thermal conduction pathways, resolving the contradiction between ease of manufacture and heat dissipation efficiency.
2Temperature
If metal lids are added to improve heat expulsion, then thermal conductivity is enhanced, but package thickness increases and manufacturing cost rises
Solution Approach 1:
The patent extracts the heat expulsion function from the traditional metal lid structure and integrates it directly into the mold compound through conductive vias. By taking out the thermal management function and embedding it within the existing package structure, the patent eliminates the need for additional external components that would increase package thickness.
Solution Approach 2:
The patent nests the conductive thermal management structure within the existing mold compound layers. The conductive vias are embedded inside the mold compound, creating a nested configuration where the thermal conduction pathways are contained within the原有 package structure, avoiding any increase in overall package thickness.
3Temperature
If thermally conductive filler materials are added to mold compound, then thermal conductivity is improved, but manufacturing cost increases substantially
Solution Approach 1:
Instead of uniformly distributing expensive thermally conductive filler materials throughout the entire mold compound, the patent applies thermal enhancement locally at specific critical locations where heat generation occurs. The conductive vias are strategically positioned to target high-heat areas, providing localized thermal management that achieves effective heat dissipation with minimal material cost.
Solution Approach 2:
The patent replaces expensive bulk thermally conductive filler materials with a more cost-effective approach using standard conductive materials filled into discrete vias. This approach uses smaller quantities of conductive material in a targeted manner, significantly reducing the overall quantity of expensive substances required while maintaining effective thermal conductivity enhancement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves substantial improvements in thermal conductivity without increasing cost, minimizing package thickness, and ensuring effective heat expulsion through the mold compound.
Implementation Method 1
forming an orifice in the mold compound layer to expose the conductive ball
Data Source
AI summary
In examples, a semiconductor package comprises a semiconductor die having a first surface on which circuitry is formed and a second surface opposite the first surface. The semiconductor package includes a mold compound, the second surface facing the mold compound. The mold compound covers the semiconductor die; a set of conductive vias exposed to a top surface of the mold compound and coupled to a metal layer in the package; a set of first conductive members vertically aligned with the semiconductor die and exposed to the top surface of the mold compound; and a set of second conductive members coupling at least some of the set of conductive vias to at least some of the set of first conductive members. The set of second conductive members is exposed to the top surface of the mold compound.