Mold Device Resin Seal Insert Electrode Nut
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Solution Overview
Problem
The existing methods for resin-sealing semiconductor devices with insert electrodes and nuts face challenges in preventing resin wraparound due to gaps, which affects axial force and quality, and are costly and difficult to manage in terms of facility and quality control.
Innovation Solution
A mold device with a simple structure that includes a rod-like member or protrusion to draw the nut close to the insert electrode, and a slide mold with cutouts to enclose the nut's bearing surface, preventing resin entry through the insert hole and screw hole communication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a magnet or electromagnet is used to attract the insert nut to prevent resin wraparound, then resin entry is prevented, but the device complexity and cost increase
Solution Approach 1:
The invention extracts the essential function of preventing resin wraparound from the complex magnetic attraction mechanism and achieves it through a simple mechanical structure. The insert electrode itself is designed with a protrusion that mechanically prevents resin entry, eliminating the need for magnets or electromagnets while maintaining the reliability of preventing resin wraparound.
Solution Approach 2:
The invention replaces expensive magnetic components with a simple, inexpensive mechanical feature integrated into the insert electrode. The protrusion structure is a permanent, passive feature that requires no additional power supply or complex control systems, significantly reducing device complexity and cost while maintaining the preventive function.
2Reliability
If dimensional design is used to eliminate gaps between electrode and nut, then resin wraparound can be prevented, but manufacturing precision requirements become extremely high
Solution Approach 1:
The invention applies preliminary action by designing the insert electrode with an integrated protrusion that proactively prevents resin entry before the problem occurs. This mechanical feature ensures gap elimination through structural design rather than relying on tight dimensional tolerances, making the process robust against manufacturing variations.
Solution Approach 2:
The invention applies local quality by adding a specific protrusion feature only at the critical location where resin entry must be prevented. This localized structural modification focuses the preventive function exactly where needed, without requiring high precision across the entire component, thus reducing overall manufacturing precision requirements.
3Reliability
If permanent magnet is used to attract insert nut, then resin entry is prevented, but magnetic force is lost at high temperature during molding
Solution Approach 1:
The invention replaces the magnetic field-based system with a purely mechanical prevention system. The protrusion on the insert electrode creates a physical barrier that prevents resin entry through mechanical means, which is unaffected by temperature. This substitution eliminates the temperature sensitivity inherent in magnetic materials while maintaining the preventive function.
Data Source
AI summary
The mold device according to the present invention is a mold device to resin-seal the semiconductor device including an insert electrode, and in the semiconductor device, the insert electrode is provided with an insert hole, a nut having a screw hole is disposed in the insert electrode so that the insert hole and the screw hole communicate with each other, the mold device includes a mold body into which resin is injected to resin-seal the semiconductor device, including a side of the insert electrode where the nut is disposed, and a rod-like member that is inserted into the insert hole, and the rod-like member is inserted into the screw hole of the nut through the insert hole of the insert electrode to draw the nut to the side of the insert electrode.