Mold-Embedded Inductor for Compact Power Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional discrete surface mount inductors used in power management systems for Ultra Low Power IoT and High-End Computing applications are undesirably large, constraining the minimum achievable form factor of device packages.
Innovation Solution
A semiconductor device package with an inductor embedded in mold material, where the inductor core is formed in an opening of the mold material, and conductive winding traces are formed around the core and embedded within the mold material, using active mold packaging and laser direct structuring processes to integrate the inductor directly into the package substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If discrete surface mount inductors are used in power management systems, then the system can achieve voltage conversion functionality, but the package size increases undesirably
Solution Approach 1:
The inductor is integrated directly into the mold material of the package substrate, merging what were previously separate components (inductor and package) into a single unified structure. This eliminates the need for discrete surface mount inductors and reduces overall package size while maintaining voltage conversion functionality.
Solution Approach 2:
The inductor is formed within the third dimension of the mold material depth, utilizing vertical space rather than only horizontal surface area. The winding traces are embedded at different depths within the mold material, allowing compact three-dimensional integration that reduces the footprint on the package surface.
2Area of stationary object
If the inductor is integrated within the mold material, then the package size is reduced, but the manufacturing process complexity increases
Solution Approach 1:
Conductive traces are embedded within the mold material during the molding process itself, before final package assembly. This preliminary integration of conductive pathways into the mold material eliminates subsequent complex assembly steps and reduces overall manufacturing complexity despite the advanced molding technique required.
Solution Approach 2:
The mold material's electrical properties are modified to enable conductive trace formation, transitioning from conventional non-conductive mold compound to a variant that can be selectively activated or contains conductive additives. This parameter change in material properties enables the inductor integration while maintaining compatibility with existing molding processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the package size by integrating the inductor within the mold material, allowing for a more compact device package and improved performance by placing the inductor in closer proximity to the integrated circuit die.
Implementation Method 1
forming the winding cavities and the core cavity in the first mold material via laser ablation
Implementation Method 2
forming lateral winding traces in the winding cavities, and forming conductive sidewalls in the core cavity
Implementation Method 3
The inductor core may include magnetic material
Data Source
AI summary
A semiconductor device package may include a package substrate, mold material formed over the package substrate, and a mold-embedded inductor that is embedded in the mold material. The mold-embedded inductor may be coupled to a die, such as a power management integrated circuit die, which may also be embedded in the mold material. The mold-embedded inductor may be formed by forming conductive traces and an inductor core in the mold material. For example, an active mold packaging (AMP) process and corresponding laser direct structuring (LDS) processes may be performed to form openings in the mold material and to activate surfaces of the mold material to facilitate subsequent plating of conductive material. Activated surfaces of the mold material may have micro-rough texture and may include bulk conductive material formed via the application of laser energy to additives in the mold material during the LDS process(es).