Mold Gate Layer Organic Material IC Package

Solution Overview

Problem

Current integrated circuit package systems face challenges in reducing manufacturing costs and cycle time due to the need for additional material layers and complex processes in forming mold gates, which increase costs and complexity.

Innovation Solution

A substrate with a conductive layer and a mold gate layer made of organic material without polymerization is used, allowing for improved manufacturing efficiency and cost-effectiveness by eliminating the need for additional layers and simplifying the process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If additional material layers are used to form mold gate, then mold gate functionality is achieved, but manufacturing cost increases

Engineering Contradiction:

Improvemold gate functionalityVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The mold gate layer is formed by depositing conductive material directly over the conductive trace-bearing surface of the substrate, merging the mold gate formation process with the existing conductive layer deposition process. This eliminates the need for separate additional material layers and reduces manufacturing complexity while maintaining mold gate functionality.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The conductive material layer serves multiple functions: it provides the conductive traces for electrical connections and simultaneously forms the mold gate structure when deposited over the active surface. This multi-functionality eliminates the need for dedicated separate layers for mold gate formation, reducing overall manufacturing cost.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If additional material layers are used to form mold gate, then mold gate functionality is achieved, but manufacturing cycle time increases

Engineering Contradiction:

Improvemold gate functionalityVSAvoidmanufacturing cycle time

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The mold gate layer is formed by depositing conductive material directly over the conductive trace-bearing surface of the substrate, merging the mold gate formation process with the existing conductive layer deposition process. This eliminates the need for separate additional material layers and reduces manufacturing complexity while maintaining mold gate functionality.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The mold gate layer is formed during the same deposition process used for creating conductive traces, performing the mold gate formation action preliminarily along with the trace formation rather than as a subsequent separate step. This reduces overall manufacturing cycle time.

Inventive Principle:

Principle #10Preliminary action

3Ease of manufacture

If mold gate is formed on opposite side from conductive traces, then packaging material flow is enabled, but substrate complexity increases

Engineering Contradiction:

Improvepackaging material flowVSAvoidsubstrate structure

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

Instead of placing the mold gate on the opposite side of the substrate (requiring through-substrate vias and complex 3D routing), the mold gate layer is formed on the same surface as the conductive traces by depositing conductive material directly over the active surface. This dimensional change simplifies the substrate structure while enabling packaging material flow through the mold gate layer itself.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS8841782B2Integrated circuit package system with mold gate

Publication Date: 2014.09.23 STATS CHIPPAC MANAGEMENT PTE LTD

AI summary

An integrated circuit package system includes: providing a substrate; forming a conductive layer over the substrate; forming a mold gate layer having an organic material without polymerization over the conductive layer; and attaching an integrated circuit over the substrate adjacent the mold gate layer.