Dual-Sided Mold Grid Array With Reshaped Solder Gap Control
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Solution Overview
Problem
Existing radio-frequency (RF) modules with conductive mounting features on packaging substrates face difficulties in achieving a flat mounting surface due to the lack of a desirable gap between the solder structures and mold structures, leading to reliability issues.
Innovation Solution
The implementation of a mold structure on the substrate that reshapes solder structures by melting and re-forming them to create a gap between the mold and solder surfaces, ensuring a flat, co-planar configuration through processes like grinding and energy application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder structures are formed without a mold structure, then the original solder shape is maintained, but no gap is provided between the solder and mold surfaces leading to reliability issues
Solution Approach 1:
The mold structure is segmented to provide individual engagement shapes around each solder structure, creating isolated gaps between the mold and solder surfaces. This segmentation allows each solder joint to have its own controlled gap space for reliability without requiring a completely complex molded assembly.
Solution Approach 2:
The mold structure is formed preliminarily to define the engagement shapes and gaps before the solder structures are fully established. This preliminary molding action creates the desired gap configuration in advance, ensuring reliability is built into the structure from the beginning rather than requiring subsequent modifications.
2Reliability
If a mold structure is added to create gaps, then reliability is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The mold structure formation is merged with the existing packaging substrate manufacturing process. The mold is integrated into the packaging assembly and formed using conventional molding techniques that are already part of the manufacturing workflow, thereby improving reliability without significantly increasing process complexity.
Solution Approach 2:
The mold structure serves multiple functions: it provides the engagement shapes around solder structures, creates the necessary gaps for reliability, and maintains the overall packaging integrity. This multi-functionality reduces the need for additional separate components or processes, keeping manufacturing relatively simple while achieving reliability goals.
3Manufacturing precision
If solder structures are reshaped by melting, then a gap is created between mold and solder, but additional energy processing is required
Solution Approach 1:
The solder structures undergo a phase transition from solid to liquid state through controlled melting, allowing them to be reshaped into the desired engagement shapes. The mold structure confines the molten solder and defines the gap configuration. After cooling, the solder solidifies with the precise shape needed for reliable mounting, achieving manufacturing precision through this phase change process.
Solution Approach 2:
Temperature parameters are changed to melt the solder structures temporarily for reshaping. By controlling the thermal parameters during the molding process, the solder transitions to a fluid state that can be shaped by the mold, then cools to solidify with the desired precision geometry, creating the necessary gaps without requiring excessive energy input.
4Ease of manufacture
If the mold structure engagement shape is based on original solder shape, then gap formation is simplified, but the original solder shape may not be optimal for final mounting
Solution Approach 1:
The mold structure is preliminarily designed with engagement shapes that anticipate the desired final solder configuration. Rather than simply replicating the original solder shape, the mold engagement shapes are pre-configured to guide the molten solder into the optimal final geometry, ensuring both ease of manufacture and manufacturing precision.
Solution Approach 2:
The engagement shape parameters in the mold are optimized to transform the solder from its original shape to the desired final mounting shape. By adjusting the mold engagement geometry parameters, the process achieves both simplified gap formation and precise final solder structure configuration for optimal mounting performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures a reliable and flat mounting surface for RF modules by maintaining the mold structure's integrity while reshaping solder structures to achieve a desirable gap, enhancing the module's reliability and performance.
Implementation Method 1
The re-shaping operation can include application of energy to melt some or all of the solder structure to allow the solder structure to be formed into the shape while the solder structure is surrounded by the mold structure
Data Source
AI summary
A dual-sided mold grid array module can include a substrate having a mounting side and a plurality of solder structures implemented thereon, with each solder structure having a shape that is different from its original shape when originally formed. The module can further include a mold structure implemented on the mounting side of the substrate and having a surface, such that each solder structure is surrounded by a respective portion of the mold structure having a shape formed based on the original shape of the solder structure, such that a gap is provided between the shape of the respective portion of the mold structure and the solder structure at or near the surface of the mold structure.