Mold Heat-Insulating Barrier Inhibits Supercooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In resin molding or cast molding, molds with limited volume face challenges in cooling, leading to supercooling issues near recesses due to the proximity of cooling channels to cavity surfaces, especially when the cavity surface has a convex-concave shape, causing unintended cooling of non-target areas and issues with material spread and release agent evaporation.
Innovation Solution
Incorporating a heat-insulating barrier with a medium of lower thermal conductivity between the cooling channel and the bottom surface of recesses in the cavity, which reduces heat propagation and prevents supercooling, while allowing for reduced mold volume and cost-effective manufacturing through additive manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of stationary object
If the cooling channel is disposed in the vicinity of the cavity surface to reduce mold volume, then the mold volume is reduced, but supercooling occurs in the vicinity of the bottom surface of the recess
Solution Approach 1:
The patent applies local quality by creating a heat-insulating barrier specifically at the location where supercooling occurs (between the cooling channel and the bottom surface of the recess). This localized modification allows the cooling channel to remain close to the cavity surface for compactness while preventing excessive heat extraction only where needed, thus maintaining uniform temperature distribution without increasing overall mold volume.
Solution Approach 2:
The heat-insulating barrier acts as an intermediary element between the cooling channel and the mold cavity. This intermediate structure mediates the heat transfer process by blocking excessive heat flow to the recess bottom surface, thereby preventing supercooling while allowing the cooling channel to function effectively for overall mold cooling.
2Productivity
If the cooling channel is disposed close to the bottom surface of the recess, then cooling efficiency is improved, but supercooling occurs causing material spread and release agent evaporation issues
Solution Approach 1:
The heat-insulating barrier is selectively positioned only at the recess bottom surface area where supercooling would occur, while allowing efficient cooling elsewhere. This localized approach maintains high cooling efficiency for the overall mold while preventing quality defects specifically at the recess areas through targeted thermal management.
Solution Approach 2:
The heat-insulating barrier serves as an intermediary that modulates heat transfer between the cooling channel and the recess bottom surface. It allows sufficient cooling to maintain productivity while preventing excessive cooling that would cause material spread and release agent evaporation, thus ensuring molding quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively inhibits supercooling near recesses, enabling better material spread and release agent evaporation, while reducing mold volume and manufacturing costs by using additive manufacturing techniques to form the cooling channel and heat-insulating barrier.
Implementation Method 1
a heat-insulating barrier which includes a space formed between the cooling channel and the bottom surface of the recess formed in the cavity surface. The space is filled with a medium having a thermal conductivity lower than that of other portions of the mold
Data Source
AI summary
A mold capable of inhibiting supercooling is provided. The mold includes a cooling channel formed therein and has a recess formed in a cavity surface, and a heat-insulating barrier formed between the cooling channel and a bottom surface of the recess formed in the cavity surface. The heat-insulating barrier includes a space formed between the cooling channel and the bottom surface of the recess formed in the cavity surface. The space is filled with a medium (for example, air) having a thermal conductivity lower than that of other portions of the mold.