Mold for Fabricating Integrated Endoscopic Probe

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Solution Overview

Problem

Existing methods for fabricating endoscopic distal tips face challenges in miniaturization, fabrication efficiency, stability, and cost, particularly due to limitations in mold design and resin-filling technologies.

Innovation Solution

A mold design for fabricating an integrated endoscopic probe, featuring a body, cover, and protrusion member, which allows for a single-piece structure and efficient resin filling, enhancing miniaturization and batch production capabilities.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a U-shape mold with single opening is used to sequentially place elements, then the elements can be arranged in the mold cavity, but the process becomes elaborate and time-consuming, reducing productivity

Engineering Contradiction:
Improveelement arrangement capabilityVSAvoidfabrication time
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The mold is divided into two halves (first half and second half) that can be opened and closed independently. This segmentation allows elements to be placed in the open state and then encapsulated by closing the mold halves, simplifying the placement process and improving productivity while maintaining manufacturing ease.

Inventive Principle:
Principle #1Segmentation

2Productivity

If injection molding technology is used to improve fabrication efficiency, then production speed increases, but high temperature and pressure damage electronic elements and wires

Engineering Contradiction:
Improvefabrication efficiencyVSAvoidtemperature and pressure damage
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The resin material's properties are changed by selecting a resin with lower viscosity and curing characteristics suitable for low-temperature, low-pressure filling. This parameter change enables the resin to fill gaps between elements without requiring high temperature and pressure, thus avoiding damage to electronic components while maintaining fabrication efficiency.

Inventive Principle:
Principle #35Parameter changes

3Adaptability or versatility

If gaps exist between electronic elements and wires before resin filling, then elements can be accommodated in the mold, but incomplete resin filling occurs, reducing manufacturing precision

Engineering Contradiction:
Improveelement placement flexibilityVSAvoidresin filling completeness
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The resin material's viscosity is optimized to be low enough to flow into and fill gaps between electronic elements and wires automatically during the filling process. This parameter change ensures complete resin filling without requiring complex additional steps, thereby achieving both element placement flexibility and manufacturing precision.

Inventive Principle:
Principle #35Parameter changes

4Ease of manufacture

If pre-formed endoscopic front end with specified thickness is required, then elements can be placed inside, but the size cannot be minimized, limiting miniaturization

Engineering Contradiction:
Improveelement placement capabilityVSAvoidendoscopic front end size
Core Design Contradiction:
Ease of manufactureVSVolume of moving object

Solution Approach 1:

The mold cavity is pre-formed with the exact final dimensions of the endoscopic front end, including the distal tip. Elements are placed into this pre-formed cavity, and the resin is then filled to encapsulate them. This preliminary action allows miniaturization while maintaining ease of element placement, as the mold cavity already defines the final small size.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed solution reduces the size of the endoscopic distal tip, improves fabrication efficiency, stabilizes product quality, and decreases production costs, making it suitable for high-precision and small-sized endoscopes.

Implementation Method 1

filling a resin material into the endoscopic front end and curing the resin material to fix the abovementioned elements

Methodology Applied
Scientific EffectCuring:

Data Source

PatentUS20250072722A1Mold for fabricating integrated endoscopic probe, integrated endoscopic probe, and method for fabricating the same
Publication Date: 2025.03.06 MEDIMAGING INTEGRATED SOLUTION INC
  • US20250072722A1 patent drawing
  • US20250072722A1 patent drawing
  • US20250072722A1 patent drawing

AI summary

A mold for fabricating an integrated endoscopic probe, and an integrated endoscopic probe, and a method for fabricating the same are provided. The mold is used to minimize the endoscopic distal tip, increase the output, and improve fabrication quality. The integrated endoscopic probe and the fabrication method thereof can reduce the size of the endoscopic distal tip, increase the efficiency and stability of the fabrication process, and reduce production cost.