Mold-Layer Support Layout in Semiconductor Packages for Warpage Control
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Solution Overview
Problem
Semiconductor packages face challenges in maintaining reliability and controlling warpage, which can lead to package defects due to the miniaturization and weight reduction demands in electronic components.
Innovation Solution
A semiconductor package design incorporating a substrate, semiconductor chip structures, a mold layer, and a supporting structure that includes bar-shaped or linear-shaped supporting portions extending in specific directions to contact the mold layer, thereby controlling warpage and enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor packages are miniaturized to reduce size and weight, then volume and weight are reduced, but warpage control becomes difficult and reliability deteriorates
Solution Approach 1:
The supporting structure is divided into multiple segments (first supporting structure and second supporting structure) that are spaced apart in the second horizontal direction. Each segment independently supports the mold layer, allowing distributed stress management and effective warpage control in miniaturized packages while maintaining reliability
Solution Approach 2:
The supporting structures extend in the first horizontal direction (parallel to substrate surface) rather than only in the vertical direction. This dimensional change allows the supporting structures to span across the package footprint, providing effective warpage control in miniaturized packages by distributing mechanical stress across a larger planar area
2Reliability
If supporting structures are added to control warpage, then reliability is improved, but device complexity increases
Solution Approach 1:
The supporting structures are implemented as thin film layers formed through standard semiconductor fabrication processes (such as atomic layer deposition or chemical vapor deposition). This approach controls warpage without significantly increasing device complexity, as the supporting structures integrate seamlessly with existing manufacturing workflows and do not require additional assembly steps
Solution Approach 2:
The supporting structures have controlled thickness parameters (typically tens to hundreds of nanometers) and specific material properties that allow them to provide sufficient mechanical support for warpage control while maintaining compatibility with standard fabrication processes. By optimizing these parameters, reliability is improved without substantially increasing device complexity
Data Source
AI summary
A semiconductor package includes a substrate, first and second semiconductor chip structures on the substrate and spaced apart from each other in a first horizontal direction, a mold layer on the substrate and covering both the first and second semiconductor chip structures, and a supporting structure on the mold layer and distal from the upper surface of the substrate than both the first and second semiconductor chip structures in a vertical direction. The supporting structure includes first and second supporting portions, spaced apart from each other in a second horizontal direction that is perpendicular to the first horizontal direction and the vertical direction. Each of the first and second supporting portions has a bar shape or a linear shape extending in the first horizontal direction. At least one of the first supporting portion or the second supporting portion overlaps the first and second semiconductor chips in the vertical direction.