Mold Material Gas Discharge Heating for Adhesion

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

During the processing of mold materials, the adherence of supports to the mold material can result in adverse effects due to gas generation, leading to insufficient bonding strength.

Innovation Solution

A method involving the heating of the mold material layer to discharge gas before adhering the support, which includes setting a suitable temperature range and environment, such as 100°C to 250°C under atmospheric or reduced pressure, to prevent gas generation and enhance bonding efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If heating is applied to the mold material to adhere the support, then bonding strength is improved, but gas is generated from the mold material causing adhesion failure

Engineering Contradiction:
Improvebonding strengthVSAvoidgas generation
Core Design Contradiction:
StrengthVSObject-generated harmful factors

Solution Approach 1:

The patent applies preliminary action by heating the mold material to discharge gas before the actual adhesion process. This pre-treatment removes harmful gases that would otherwise interfere with bonding, allowing subsequent heating to achieve strong adhesion without gas-generation problems.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent segments the heating process into two distinct stages: a first heating step for gas discharge at lower temperature, and a second heating step for adhesion at higher temperature. This segmentation allows each step to optimize for its specific purpose without the negative effects of the other.

Inventive Principle:
Principle #1Segmentation

2Strength

If heating temperature is increased to improve adhesion, then bonding strength increases, but gas generation from mold material worsens

Engineering Contradiction:
Improveadhesion strengthVSAvoidheating temperature
Core Design Contradiction:
StrengthVSTemperature

Solution Approach 1:

The patent divides the heating process into two temperature stages: first heating at a lower temperature range to discharge gas, and second heating at a higher temperature range to achieve strong adhesion. This segmentation resolves the contradiction by separating the temperature requirements for gas discharge and adhesion into distinct sequential steps.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively reduces the adverse effects of gas generation during the adherence process, ensuring stronger bonding between the support and the mold material, thereby improving processing outcomes.

Implementation Method 1

heating a mold material layer formed of the mold material to discharge gas from the mold material constituting the mold material layer

Methodology Applied
Scientific EffectHeating: Heating

Data Source

PatentUS10607876B2Method for processing mold material and method for manufacturing structural body
Publication Date: 2020.03.31 AIMECHATEC LTD
  • US10607876B2 patent drawing
  • US10607876B2 patent drawing
  • US10607876B2 patent drawing

AI summary

A method for processing a mold material which includes a heating step of heating a mold material layer formed of the mold material to discharge gas from the mold material constituting the mold material layer.