Mold Member Segmentation for Semiconductor Package Warpage
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Solution Overview
Problem
Current semiconductor packages face challenges in reliability due to thermal and physical stress, which can lead to warpage and reduced performance, especially as they become smaller and more complex.
Innovation Solution
A semiconductor package design that includes a first sub-semiconductor package, an interposer substrate with holes, and a second sub-semiconductor package, where the interposer substrate features a mold member with a mold main portion, a connecting portion, and a protruding portion to reduce stress and enhance structural support, allowing for improved interconnection and reduced warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the semiconductor package size is reduced to meet miniaturization demands, then the device footprint is smaller, but thermal and physical stress increases leading to warpage and reliability issues
Solution Approach 1:
The package structure is segmented into multiple functional layers including substrate, mold member, and interposer substrate with distinct stress management roles. The mold member is further segmented into a body portion and a protruding portion that extends into the hole, creating localized stress distribution zones that prevent overall package warpage while maintaining compact dimensions.
Solution Approach 2:
The mold member exhibits local quality variations through its different portions: the body portion provides general encapsulation and protection, while the protruding portion specifically targets stress concentration at the interface between substrate and interposer substrate. This localized structural differentiation allows the compact package to manage thermal and physical stress effectively without increasing overall size.
2Ease of manufacture
If a simple mold member structure is used, then manufacturing is easier, but stress management is insufficient leading to warpage
Solution Approach 1:
The mold member is divided into a body portion and a protruding portion that can be formed in sequence or as an integrated structure with distinct functional zones. This segmentation allows manufacturers to use standard molding processes for the body while adding the protruding portion through targeted material deposition or secondary molding, balancing manufacturing simplicity with the structural complexity needed for stress management.
Solution Approach 2:
The protruding portion of the mold member acts as an intermediary element between the substrate and interposer substrate, mediating the stress transfer and distribution. This intermediate structure provides a gradual transition zone that reduces abrupt stress concentrations, maintaining structural stability without requiring complex multi-component assembly processes.
3Quantity of substance
If the mold member covers only the semiconductor device, then material usage is minimized, but stress propagation occurs causing warpage
Solution Approach 1:
The mold member's coverage is segmented into two functional zones: the body portion that encapsulates the semiconductor device and minimizes material usage, and the protruding portion that extends into the hole to provide stress management at the interface region. This segmented coverage strategy ensures adequate stress resistance without excessive material consumption.
Solution Approach 2:
The mold member provides differentiated coverage: dense encapsulation around the semiconductor device for protection, and a more localized protruding portion at the stress-critical interface. This local quality differentiation allows the structure to resist warpage at key locations while minimizing overall material usage in less critical areas.
4Ease of manufacture
If traditional bonding methods are used, then interconnection is straightforward, but thermal stress management is inadequate
Solution Approach 1:
The protruding portion of the mold member serves as a thermal intermediary between the substrate and interposer substrate, providing a gradual thermal transition zone that reduces thermal shock and stress. This intermediate structure allows heat to dissipate more uniformly across the interface, managing thermal stress without complicating the bonding process.
Solution Approach 2:
The mold member structure modifies the thermal parameters at the interface by introducing a protruding portion with different thermal mass and conductivity characteristics. This structural parameter change creates a thermal buffer zone that reduces peak temperatures and thermal gradients during operation and processing, effectively managing thermal stress while maintaining manufacturing simplicity.
Data Source
AI summary
A semiconductor package includes a first sub-semiconductor package, an interposer substrate, and a second sub-semiconductor package that are sequentially stacked. The first sub-semiconductor package includes a first package substrate, a first semiconductor device, and a first mold member that are sequentially stacked, and the interposer substrate includes at least one hole. The first mold member includes: a mold main portion which covers the first semiconductor device; a mold connecting portion extended from the mold main portion and inserted into the at least one hole; and a mold protruding portion extended from the mold connecting portion to cover a top surface of the interposer substrate outside the at least one hole. The mold main portion, the mold connecting portion, and the mold protruding portion constitute a single object.