Mold Release Film for Semiconductor Packaging
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Solution Overview
Problem
The existing mold release films used in semiconductor packaging processes often contaminate the resin-encapsulation portion and the mold due to oligomers from fluororesin, leading to reduced adhesion between the resin-encapsulation portion and the ink layer, and decreased production efficiency.
Innovation Solution
A mold release film with a fluororesin layer on the surface in contact with the curable resin and a solvent-treated fluororesin film to reduce contaminant components, ensuring a F/Al ratio of 0.2 to 4 and F/(C+F+O) ratio of 0.1 to 0.3, which minimizes contamination and enhances adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a mold release film is disposed on the cavity surface of the mold to prevent adhesion, then releasability is improved, but volatile components such as oligomers in the mold release film migrate to the mold side causing mold contamination
Solution Approach 1:
The mold release film is divided into multiple functional layers: a fluororesin layer providing releasability, a support layer providing mechanical strength, and a gas barrier layer preventing contamination. This segmentation allows each layer to perform its specific function independently, resolving the contradiction between releasability and contamination prevention.
Solution Approach 2:
A gas barrier layer made of metal or metal oxide is introduced as an intermediary between the fluororesin layer and the support layer. This intermediary layer specifically blocks the migration of volatile components while allowing the fluororesin layer to maintain its releasability function, thus preventing mold contamination without sacrificing releasability.
2Ease of operation
If a mold release film is disposed on the cavity surface by vacuuming to hold the film, then the film is securely positioned, but volatile components are likely to migrate to the mold side causing mold contamination
Solution Approach 1:
The gas barrier layer serves as a protective intermediary that prevents volatile components from reaching the mold surface, regardless of how the mold release film is positioned or held in place during the vacuuming process.
Solution Approach 2:
The gas barrier layer provides localized contamination prevention specifically at the interface between the mold release film and the mold cavity, allowing other parts of the system to maintain their original functions without modification.
3Reliability
If a release agent is blended to the curable resin to improve releasability, then adhesion between resin and mold is reduced, but the release agent present at the surface causes poor adhesion between the resin-encapsulation portion and the ink layer
Solution Approach 1:
The release agent function is extracted from the curable resin and transferred to a dedicated mold release film made of fluororesin. This separation allows the curable resin to cure without release agents, ensuring good adhesion for the ink layer, while the mold release film provides the necessary releasability at the mold interface.
Solution Approach 2:
The mold release film acts as an intermediary between the mold and the curable resin, providing releasability without introducing release agents into the resin system. This intermediary approach maintains the purity of the cured resin surface, ensuring proper adhesion for subsequent ink layer application.
4Object-generated harmful factors
If a gas barrier layer is added to the mold release film to prevent contamination, then mold contamination is reduced, but the structure and process complexity increases
Solution Approach 1:
The gas barrier layer is specifically positioned only where contamination prevention is needed - between the fluororesin layer and the support layer - without adding complexity to other parts of the mold release film structure or the overall molding process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents contamination and improves the adhesion between the resin-encapsulation portion and the ink layer, reducing the likelihood of the ink layer peeling off and maintaining production efficiency.
Implementation Method 1
at least the first surface is made of a fluororesin
Implementation Method 2
a solvent-treated fluororesin film to reduce contaminant components
Data Source
AI summary
A mold release film, which is excellent in releasability and capable of suppressing contamination of a mold or a resin-encapsulation portion by the mold release film and forming a resin-encapsulation portion excellent in adhesion to an ink layer, is provided. The mold release film is disposed on a cavity surface of a mold, in which a semiconductor element is disposed and encapsulated with a curable resin to form a resin-encapsulation portion. The mold release film has a first surface in contact with the curable resin when the resin-encapsulation portion is formed, and a second surface in contact with the cavity surface. At least the first surface is made of a fluororesin. The mold release film has an F/Al ratio of from 0.2 to 4, or an F/(C+F+O) ratio of from 0.1 to 0.3. A process for producing a semiconductor package using the mold release film is also provided.