Mold Release Surface Layer for Embedded Sensor Devices

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Solution Overview

Problem

In contact lens manufacturing, the release process from molds can damage embedded circuitry or mechanically-sensitive components, such as sensors, due to mechanical rupture or other methods used in commercial processes.

Innovation Solution

A method involving the formation of first and second polymer layers between mold surfaces, with surface layers facilitating the release of these layers without damaging the embedded components, allowing for the precise positioning and enclosure of sensors within the body-mountable device.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If mechanical rupture or conventional release processes are used, then the contact lens can be released from the mold, but the embedded circuitry or sensors are damaged

Engineering Contradiction:

Improverelease processVSAvoidcomponent integrity

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

A release agent layer is applied to the mold surface to act as an intermediary between the polymer material and the mold. This release agent facilitates easy removal of the cured contact lens from the mold without requiring mechanical rupture, thereby protecting embedded circuitry and sensors from damage while maintaining manufacturing efficiency

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The surface properties of the mold are modified by applying a release agent that changes the friction and adhesion parameters between the mold surface and the polymer material. This parameter change enables smooth release without mechanical force that would damage sensitive components

Inventive Principle:

Principle #35Parameter changes

2Productivity

If mechanical rupture is used for release, then the polymer layer can be removed from the mold, but the precision and integrity of embedded components are compromised

Engineering Contradiction:

Improverelease efficiencyVSAvoidcomponent placement accuracy

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The release agent serves as a mediator that enables high-speed release processes without the need for mechanical rupture. This allows maintained manufacturing precision and component integrity while achieving efficient production rates

Inventive Principle:

Principle #24Intermediary (Mediator)

3Device complexity

If conventional molding release methods are used, then the manufacturing process is simple, but the embedded sensors and circuitry suffer damage

Engineering Contradiction:

Improvemolding processVSAvoidmechanical damage to components

Core Design Contradiction:

Device complexityVSObject-affected harmful factors

Solution Approach 1:

The release agent is applied to the mold surface to prevent direct adhesion between the polymer material and the mold. This intermediary layer eliminates mechanical damage to embedded components during release while maintaining a relatively simple molding process that does not require complex release mechanisms

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The mechanical rupture method is replaced with a chemical release mechanism using the release agent. This substitution eliminates the harmful mechanical forces that damage embedded components while maintaining process simplicity

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS9789655B1Methods for mold release of body-mountable devices including microelectronics

Publication Date: 2017.10.17 VERILY LIFE SCIENCES LLC

AI summary

A body-mountable device may include a first polymer layer, a second polymer layer, and a structure that includes a sensor between the first and second polymer layers. Fabricating the body-mountable device may involve providing a respective surface layer on each of one or more molding pieces, forming a first polymer layer, positioning the structure on the first polymer layer and then forming, between molding pieces, the second polymer layer over the structure positioned on the first polymer layer. The surface layer of each molding piece may facilitate release of the polymer layer or fabricated body-mountable device without disruption to the embedded structure.