Mold Resin Sidewall Structure to Prevent Cracks During Resin Cutting
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Solution Overview
Problem
During the resin cutting process in the manufacturing of semiconductor devices, shearing stress applied to the resin in the runners can cause cracks in the molded sections, leading to potential failures in the semiconductor device.
Innovation Solution
The introduction of a dowel section between the inclined surfaces and the residual section on the third side surface of the mold resin allows the punch to break the dowel section as a dummy during resin cutting, preventing cracks from forming in the mold forming section.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If resin cutting is performed to remove unnecessary resin from runners, then productivity is improved through efficient material removal, but cracks occur in the molded section from the root of the residual section
Solution Approach 1:
The dowel section is formed as a protrusion on the third side surface of the mold resin before the resin cutting process. This preliminary structural feature serves as a predetermined breaking point that guides the punch to break the dowel section first, preventing cracks from propagating into the molded section during subsequent resin cutting operations.
Solution Approach 2:
The dowel section acts as an intermediary element between the punch and the molded section. By positioning the dowel section as a protruding feature on the third side surface, it intercepts the punch's force during resin cutting, serving as a sacrificial component that absorbs the cutting stress and prevents direct transmission of harmful forces to the molded section.
2Ease of manufacture
If the punch applies force directly to the residual section during resin cutting, then resin cutting can be performed, but shearing stress causes cracks to form in the molded section
Solution Approach 1:
The third side surface of the mold resin is given a different local quality compared to other surfaces by forming the dowel section as a protrusion. This localized structural modification creates a specific breaking point that is easier to cut than the main molded section, allowing the punch to remove resin without applying damaging shearing stress to the molded section.
Solution Approach 2:
The resin structure is segmented into functional zones: the molded section containing the semiconductor device, the runner section with unnecessary resin, and the dowel section as an intermediate breaking point. This segmentation allows the resin cutting process to target the dowel section first, separating it from the molded section and preventing crack propagation.
Data Source
AI summary
The third side surface includes inclined surfaces inclined in a direction in which a center in an up-down direction of the third side surface is convex. The mold resin further includes a residual section provided in the center of the third side surface and a dowel section provided between the inclined surface and the residual section. The dowel section projects further in a lateral direction than the inclined surface. The residual section further projects in the lateral direction than the dowel section and has a fracture surface perpendicular to the up-down direction.