Mold for Substrate Surface Functionalization

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Solution Overview

Problem

Current methods for functionalizing organic glass substrates, such as PMMA, face challenges in achieving uniform spatial distribution of expensive functional substances, leading to high manufacturing costs and uneven modified layers due to issues like solvent volatilization and leveling problems during surface functionalization processes like dipping or spraying.

Innovation Solution

A mold for substrate surface functionalization is introduced, comprising an upper and lower mold plate, a rubber strip, and a positioning structure, which forms a pouring space between the substrate and the mold plates to allow for controlled application and curing of a modified material, ensuring even distribution and consistent thickness of the functional layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If comprehensive functionalization is carried out during a single curing process of organic glass, then the substrate obtains multiple functions, but the spatial distribution of expensive functional substances cannot be regulated, leading to high manufacturing cost

Engineering Contradiction:
Improvefunctionalization effectivenessVSAvoidamount of functional substances
Core Design Contradiction:
Adaptability or versatilityVSQuantity of substance

Solution Approach 1:

The patent divides the functionalization process into two stages: first, comprehensive functionalization during curing to provide multiple functions; second, surface-specific functionalization using a mold to regulate spatial distribution. This segmentation allows expensive functional substances to be concentrated only where needed on the surface, reducing overall consumption while maintaining versatility.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies local quality by using a mold structure that enables functional substances to be precisely distributed only on the surface of the substrate rather than uniformly throughout. The mold creates a controlled environment where functional materials are concentrated at specific locations (the surface), optimizing both cost efficiency and functional performance.

Inventive Principle:
Principle #3Local quality

2Quantity of substance

If functionalization is carried out only on surfaces of organic glass by dipping or spraying, then cost is reduced, but the modified layer has uneven thickness and shrinkage problems affecting appearance and performance

Engineering Contradiction:
Improveamount of functional substancesVSAvoidthickness consistency of modified layer
Core Design Contradiction:
Quantity of substanceVSManufacturing precision

Solution Approach 1:

The patent introduces a mold as an intermediary tool between the functional substances and the substrate surface. The mold acts as a mediator that shapes and controls the distribution of functional materials during the surface functionalization process, ensuring uniform thickness and eliminating shrinkage defects that occur with direct dipping or spraying methods.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent applies preliminary action by using the mold to pre-shape and position the functional substances before they are applied to the substrate surface. This preliminary structuring ensures that the functional layer achieves uniform thickness and proper distribution from the outset, preventing subsequent shrinkage and appearance defects.

Inventive Principle:
Principle #10Preliminary action

3Quantity of substance

If dipping or spraying methods are used for surface functionalization, then cost is reduced, but solvent volatilization and leveling performance differences cause uneven modified layer thickness

Engineering Contradiction:
Improveamount of functional substancesVSAvoiduniformity of modified layer
Core Design Contradiction:
Quantity of substanceVSStability of the object's composition

Solution Approach 1:

The mold serves as an intermediary structure that controls the environment in which functional substances are applied to the substrate surface. It prevents solvent volatilization issues and ensures uniform leveling by providing a controlled confinement space, thereby achieving consistent modified layer thickness and composition uniformity.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces costs by using fewer functional substances and achieves a smooth, evenly distributed modified layer with consistent thickness, improving both the appearance and performance of the functionalized substrate.

Implementation Method 1

pouring a modified material for surface functionalization of the substrate into the corresponding pouring space through the pouring opening; and curing the modified material to form a modified layer

Methodology Applied
Scientific EffectCuring: Photopolymerisation

Data Source

PatentUS20240091988A1Mold for substrate surface functionalization, and method for substrate surface functionalization
Publication Date: 2024.03.21 HAIYAN HUASHUAITE PLASTIC ELECTRICAL APPLIANCES CO LTD
  • US20240091988A1 patent drawing
  • US20240091988A1 patent drawing
  • US20240091988A1 patent drawing

AI summary

The present application relates to a mold for substrate surface functionalization. In the mold, a rubber strip is provided between an upper mold plate and a lower mold plate in a clamping manner, and a fastening structure enables the upper mold plate and the lower mold plate to clamp in opposite directions, such that the rubber strip, the upper mold plate and the lower mold plate form a mold cavity together under the action of a clamping force; and a positioning structure is used for fixing a substrate in the mold cavity, such that a pouring space is formed between at least one side surface of the substrate and the upper mold plate and/or the lower mold plate, the pouring space being used for pouring a modified material for surface functionalization of the substrate. The present invention further relates to a method for substrate surface functionalization.