Molded Article With Integrated Circuit Sheet
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Solution Overview
Problem
The existing methods for manufacturing molded articles with integrated circuit sheets require multiple molding molds and injection processes, increasing manufacturing costs and complexity.
Innovation Solution
A method involving a single set of molds where a circuit sheet with conductive patterns is positioned and clamped to form a cavity, allowing molten material to contact and solidify around it, reducing the need for multiple molds and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple molding molds and injection processes are used to manufacture molded articles with integrated circuit sheets, then the manufacturing precision and reliability of the circuit sheet positioning are improved, but the manufacturing cost and device complexity increase
Solution Approach 1:
The patent combines multiple molding operations into a single integrated mold system. The first mold includes both the plateau portion for circuit sheet positioning and the cavity for resin injection, eliminating the need for separate positioning fixtures and multiple molds. This merging reduces device complexity while maintaining positioning accuracy through the integrated design of the protruding portions and cavity.
Solution Approach 2:
The first mold serves multiple functions: the plateau portion with protruding portions provides circuit sheet positioning and fixation, while the cavity receives and molds the resin around the circuit sheet. This multi-functional design replaces what would traditionally require separate positioning devices and molding operations, reducing overall system complexity.
2Manufacturing precision
If multiple molding molds and injection processes are used to manufacture molded articles with integrated circuit sheets, then the manufacturing precision and reliability of the circuit sheet positioning are improved, but the manufacturing cost increases
Solution Approach 1:
The patent combines multiple molding operations into a single integrated mold system. The first mold includes both the plateau portion for circuit sheet positioning and the cavity for resin injection, eliminating the need for separate positioning fixtures and multiple molds. This merging reduces device complexity while maintaining positioning accuracy through the integrated design of the protruding portions and cavity.
Solution Approach 2:
The first mold serves multiple functions: the plateau portion with protruding portions provides circuit sheet positioning and fixation, while the cavity receives and molds the resin around the circuit sheet. This multi-functional design replaces what would traditionally require separate positioning devices and molding operations, reducing overall system complexity.
3Device complexity
If a single set of molds is used to manufacture molded articles with integrated circuit sheets, then the manufacturing cost and device complexity are reduced, but the accuracy and strength of resin fixation around the circuit sheet may be compromised
Solution Approach 1:
The patent applies local quality by creating distinct regions within the single mold: the plateau portion with protruding portions provides localized positioning and fixation for the circuit sheet, while the cavity provides the molding environment. This localized differentiation ensures precise resin fixation around the circuit sheet without requiring complex overall mold configurations.
Solution Approach 2:
The circuit sheet is preliminarily positioned and fixed to the plateau portion before resin injection. The protruding portions are designed to engage with the circuit sheet in advance, establishing precise positioning that is then maintained during the resin molding process, ensuring both simplicity and precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the cost-effective production of molded articles with integrated circuit sheets by simplifying the mold configuration and reducing the number of molding steps, enhancing the accuracy and strength of the resin fixation around the circuit sheet.
Implementation Method 1
cooling and solidifying the molten material to form a molded body made of resin
Data Source
Figure 1
Figure 2
Figure 3(a)~3(b)
AI summary
Problem To inexpensively provide a molded article in which a circuit sheet is inserted. Solution means In a first step, a circuit sheet 20 is set such that a first region AR1 of a second main surface 22 of the circuit sheet 20 is in contact with a plateau portion 110 of a first mold 101 and a second region AR2 is not in contact with the first mold 101. In the first step, a first fixed portion of the circuit sheet 20 is arranged on a first portion Pa1 of the first mold 101, and a second fixed portion is arranged on a second portion Pa2 of the first mold 101. The first portion Pa1 is a portion that is higher than the plateau portion 110 and runs along at least one of a first protruding portion 121 and a second protruding portion 122 provided along the plateau portion 110. The second portion Pa2 is a portion where the first protruding portion 121 or the second protruding portion 122 is not provided along the plateau portion 110.