Molded Electronic Assembly With Patterned Heat Dissipation Paths
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Molded electronic assemblies face significant heat concentration issues, leading to reduced operational efficiency and lifespan of encapsulated electronic devices, particularly LEDs, due to increased heating temperatures, which damages the plastic structure and affects reliability.
Innovation Solution
Incorporating a patterned heat dissipation structure with a high heat conductive coefficient (≥6 W/mK) that extends in multiple directions from signal contacts on the circuit substrate, enhancing heat dissipation by providing multiple paths for heat to escape, while maintaining a decorative layer with transparent regions to allow light emission from LEDs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic devices are encapsulated in molded structure, then integration and protection are improved, but heat concentration occurs leading to reduced lifespan and operational efficiency
Solution Approach 1:
A heat dissipation structure is introduced as an intermediary component between the electronic devices and the molded structure. This heat dissipation structure includes a heat dissipation layer with high thermal conductivity material that conducts heat away from the electronic devices, preventing heat concentration while maintaining the protective encapsulation function of the molded structure.
2Temperature
If heat dissipation structure is added to improve heat dissipation, then temperature control is improved, but device complexity increases
Solution Approach 1:
The heat dissipation structure is merged with the circuit substrate by forming the heat dissipation layer on the circuit substrate. This integration approach combines the heat dissipation function with the existing substrate structure, avoiding the need for separate complex heat dissipation components and reducing overall device complexity while maintaining effective temperature control.
3Illumination intensity
If transparent regions are created for light emission, then light transmission is improved, but heat dissipation efficiency may be reduced
Solution Approach 1:
The heat dissipation layer is designed with locally varied thermal conductivity properties. In regions corresponding to transparent areas where light emission is needed, the heat dissipation layer maintains appropriate thermal conductivity to dissipate heat while allowing light transmission. This local quality adjustment ensures both light transmission and heat dissipation functions are optimized in their respective regions without compromising either performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively extends the lifespan of electronic devices by improving heat dissipation, preventing temperature-related damage and maintaining operational efficiency, while ensuring effective light transmission through transparent regions.
Implementation Method 1
The at least one patterned heat dissipation structure corresponds to a signal contact of the signal contacts and starts from the corresponding signal contact and extends toward a plurality of directions on the top surface of the substrate
Implementation Method 2
The patterned heat dissipation structure has a first transparent region. The decorative layer is located on one side of the circuit substrate and has a second transparent region
Data Source
AI summary
A molded electronic assembly including a circuit substrate, a plurality of electronic devices, and at least one patterned heat dissipation structure is provided. The circuit substrate includes a substrate and a circuit, where the substrate has a top surface, and the circuit has a plurality of signal contacts distributed on the top surface. The electronic devices are disposed on the circuit substrate, and each of the electronic devices has a plurality of device pins connected to the signal contacts. The at least one patterned heat dissipation structure corresponds to a signal contact of the signal contacts and starts from the corresponding signal contact and extends toward a plurality of directions on the top surface of the substrate.