Molded Body Cutout for Semiconductor Heat Dissipation
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Solution Overview
Problem
Existing methods for producing electronic components with embedded semiconductor chips often result in the chip's surface being covered by the molded body, which hinders heat dissipation and optical emission, and require complex processes for creating cutouts or undercuts.
Innovation Solution
A method involving a sacrificial structure formed using photolithography, where a molded body is created around the structure and the chip, allowing for partial exposure of the chip's surface and easy removal of the structure to form cutouts or undercuts, enabling efficient heat dissipation and maintaining optical emission capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the molded body completely covers the semiconductor chip surface, then the component has better mechanical protection and sealing, but heat dissipation and optical emission are hindered
Solution Approach 1:
The molded body is segmented to create a cutout that exposes the semiconductor chip surface. This segmentation allows the chip surface to be divided into covered regions (for protection) and exposed regions (for heat dissipation and optical emission), resolving the contradiction between complete coverage and surface exposure requirements
Solution Approach 2:
Different regions of the semiconductor chip have different quality requirements. The cutout creates local exposure where heat dissipation and optical emission are needed, while other regions remain covered for mechanical protection. This local differentiation of coverage quality resolves the contradiction between uniform protection and localized exposure
2Temperature
If traditional methods are used to create cutouts or undercuts in the molded body, then the chip surface can be exposed, but the production process becomes complex and costly
Solution Approach 1:
The sacrificial structure is placed on the carrier before the molding process. This preliminary action defines the future cutout location and shape, allowing the molded body to be formed with an integrated cutout in a single molding step. This eliminates the need for subsequent complex cutting or machining operations to create the cutout
Solution Approach 2:
The sacrificial structure serves as an intermediary element during manufacturing. It temporarily occupies the space where the cutout will eventually be, enabling the molded body to be formed with the correct geometry. After molding, the sacrificial structure is removed, leaving the desired cutout. This intermediary approach simplifies the overall manufacturing process compared to direct cutting methods
3Temperature
If the entire chip surface is exposed, then heat dissipation is maximized, but the component loses mechanical protection and sealing
Solution Approach 1:
The molded body coverage is segmented to create distinct covered and exposed regions on the chip surface. This segmentation allows simultaneous achievement of mechanical protection (covered regions) and heat dissipation (exposed regions), resolving the contradiction between complete coverage and complete exposure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for simple and cost-effective production of electronic components with exposed surfaces for heat dissipation and optical emission, while enabling precise structuring and efficient connection methods, such as pegs and grooves for component alignment.
Implementation Method 1
The sacrificial structure is formed from a photoresist by means of a photolithographic process
Data Source
AI summary
An electronic component, an optoelectronic component, and a component arrangement are disclosed. In an embodiment the electronic component includes an electronic semiconductor chip and a molded body, wherein the molded body covers at least one side face of the electronic semiconductor chip, wherein a surface of the electronic semiconductor chip is at least partly not covered by the molded body, wherein the molded body includes a first side face with a peg, and wherein the molded body includes a second side face with a groove matching the peg.