Molded Dual-Lens Camera Module for Precise Alignment and Low Thickness

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Solution Overview

Problem

Conventional dual lens camera modules face issues with inconsistent imaging quality due to uncontrollable dimension and positioning of lens bases, weak rigidity of circuit boards, increased thickness, and exposure of electronic components leading to contamination and increased size, which affect the image synthesis process.

Innovation Solution

The solution involves a circuit board assembly with a mold sealer that encloses electronic elements, reducing the need for safety distances and adhesive, enhancing rigidity, and integrating optical lenses and filters without additional supporting frames, using a molding process to ensure uniformity and alignment of imaging modules.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If lens bases are individually mounted on the circuit board to connect with each other via the circuit board, then the circuit board can provide electrical connection, but the dimension and position parameters become hard to control and the overall rigidity decreases

Engineering Contradiction:
Improveelectrical connectionVSAvoiddimension and position parameters
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent merges the lens bases into a single integrated lens base structure that is directly mounted on the circuit board, eliminating the need for individual lens bases. This integration ensures precise control of dimension and position parameters while maintaining electrical connection functionality through the unified structure.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated lens base serves multiple functions simultaneously: it provides mechanical support for the lens motor assembly, ensures precise positioning, and maintains electrical connection through the circuit board. This multi-functional design resolves the contradiction by combining what were previously separate functions into one unified component.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Ease of manufacture

If the circuit board is used to connect lens bases with each other, then electrical connection is achieved, but the circuit board is easy to be deformed or bent due to weak rigidity

Engineering Contradiction:
Improveelectrical connectionVSAvoidrigidity
Core Design Contradiction:
Ease of manufactureVSStrength

Solution Approach 1:

The patent combines the lens base and lens motor assembly into a single integrated unit that is directly mounted on the circuit board. This merging eliminates the need for multiple separate components connected through the circuit board, thereby reducing the circuit board's structural load and preventing deformation while maintaining electrical connectivity.

Inventive Principle:
Principle #5Merging (Combining)

3Strength

If lens motor assemblies are wrapped within the supporting frame, then the structure is supported, but adhesive must be applied to gaps which increases the overall size

Engineering Contradiction:
Improvestructural supportVSAvoidoverall size
Core Design Contradiction:
StrengthVSVolume of moving object

Solution Approach 1:

The patent merges the lens motor assembly with the lens base into a single integrated structure, eliminating the need for a separate supporting frame. This integration removes the gaps that would require adhesive application, thereby reducing the overall size of the camera module while maintaining structural support through the unified design.

Inventive Principle:
Principle #5Merging (Combining)

4Ease of manufacture

If circuit protrusion and gold wire protrude from the circuit board, then electrical connection is established, but they adversely affect the assembling process and cause contamination

Engineering Contradiction:
Improveelectrical connectionVSAvoidcontamination
Core Design Contradiction:
Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The patent extracts and eliminates the protruding circuit protrusion and gold wire from the assembly by using the integrated lens base design that directly mounts on the circuit board. This removal of protruding elements prevents them from interfering with the assembling process and eliminates the risk of contamination they would cause.

Inventive Principle:
Principle #2Taking out (Extraction)

Data Source

PatentEP3419276B1Array camera module, molded photosensitive component and circuit board component of same, manufacturing method therefor, and electronic device
Publication Date: 2025.06.25 NINGBO SUNNY OPOTECH CO LTD
  • EP3419276B1 patent drawingFigure 1A~1B
  • EP3419276B1 patent drawingFigure 2A
  • EP3419276B1 patent drawingFigure 2B

AI summary

An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.