Molded Card Guide Chassis Vibration Dampening
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Solution Overview
Problem
The complex and costly assembly of card guide chassis for aircraft, which are typically formed from numerous parts, requires efficient and cost-effective solutions for manufacturing and vibration dampening, especially in harsh environments.
Innovation Solution
A molded card guide chassis with integrally formed components, including a chassis body made from composite materials like glass fiber composites, providing vibration dampening and reduced part count, along with conductive features for grounding and reduced assembly labor, utilizing molded U channels and wedge lock mechanisms for secure module retention.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If card guide chassis are formed from numerous parts, then assembly flexibility and adaptability are improved, but assembly complexity and manufacturing cost increase
Solution Approach 1:
The patent integrates multiple separate components (chassis body, card guides, vibration dampeners, grounding features) into a single molded composite structure. This merging eliminates the need for complex assembly of numerous parts while maintaining all necessary functions through integral formation of components during the molding process.
Solution Approach 2:
The molded composite chassis serves multiple functions simultaneously: structural support, vibration dampening, electrical grounding, and mechanical retention of line replaceable modules. By incorporating diverse functional features into a single multi-functional component, the design reduces assembly complexity while preserving adaptability.
2Ease of repair
If traditional multi-part card guide chassis are used, then ease of repair and component replacement are improved, but manufacturing cost and assembly time increase
Solution Approach 1:
The patent combines multiple replaceable components into a single molded unit that can itself be replaced as one assembly. This approach maintains ease of repair at the system level while dramatically reducing assembly time by eliminating the need to assemble numerous individual parts during installation.
Solution Approach 2:
The chassis components are pre-integrated during manufacturing through molding, so that when replacement is needed, the entire pre-assembled unit can be installed in one action. This preliminary integration of components during production eliminates time-consuming assembly operations during maintenance or installation.
3Adaptability or versatility
If numerous parts are assembled to form card guide chassis, then adaptability to different configurations is improved, but manufacturing precision and quality consistency deteriorate
Solution Approach 1:
The patent merges multiple precision components into a single molded part, eliminating the accumulation of tolerances that occurs when assembling numerous parts. The molding process produces consistent dimensional accuracy and quality across all chassis, ensuring reliable fit and function without the variability introduced by multi-part assembly.
4Ease of operation
If conventional card guide chassis are used, then ease of operation is maintained, but vibration dampening and protection of electronic components worsen
Solution Approach 1:
The patent employs molded composite materials that inherently provide vibration dampening properties while maintaining the structural integrity and operational simplicity of the chassis. The composite material absorbs and dissipates vibration energy, protecting sensitive electronic components without complicating the operation or installation of the system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces manufacturing costs, improves production quality and reliability, enhances vibration dampening, and provides a secure and conductive environment for electronic components, while minimizing labor and variability, and reducing exposure to hazardous chemicals.
Implementation Method 1
providing vibration dampening for the sensitive electronic components
Implementation Method 2
utilizing molded U channels and wedge lock mechanisms for secure module retention
Data Source
Figure 1A~1B
Figure 2
Figure 3
AI summary
A chassis to receive a line replaceable module including a molded body (102) formed from a composite material, a card guide (110) integrally formed in the molded body to receive the line replaceable module, the card guide including a card guide wall (112) integrally formed in the molded body and extending outwardly from the molded body, and a plurality of tolerance features (120) disposed within the card guide to retain the line replaceable module.