Molded Cavity Substrate MEMS Package Fabrication
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Solution Overview
Problem
The complex fabrication process of Micro Electro Mechanical Systems (MEMS) packages increases their fabrication cost due to the difficulty in forming the cavity within the package.
Innovation Solution
A molded cavity substrate MEMS package is formed using a molded ring made of dielectric material, which is created by molding directly onto a substrate, simplifying the process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a traditional cavity formation method is used in MEMS package fabrication, then the cavity can be formed to house the MEMS sensor die, but the fabrication process becomes complex and costs increase
Solution Approach 1:
The patent combines the cavity formation process with the substrate manufacturing process itself. The molded substrate is designed with an integrated cavity as part of its structure, eliminating the need for separate cavity formation steps. This merging of functions reduces overall process complexity and manufacturing cost while maintaining the required cavity functionality for housing the MEMS sensor die.
2Ease of manufacture
If a traditional cavity formation method is used in MEMS package fabrication, then the cavity can be formed to house the MEMS sensor die, but fabrication costs increase
Solution Approach 1:
The patent combines the cavity formation process with the substrate manufacturing process itself. The molded substrate is designed with an integrated cavity as part of its structure, eliminating the need for separate cavity formation steps. This merging of functions reduces overall process complexity and manufacturing cost while maintaining the required cavity functionality for housing the MEMS sensor die.
Data Source
AI summary
Methods and systems for a molded cavity substrate Micro Electro Mechanical Systems (MEMS) package may comprise a MEMS electronic component, a base substrate comprising a first conductive through via, a molded ring coupled to the base substrate, and a lid substrate comprising dielectric material and a metal layer. The molded ring comprises a second conductive through via and a molded cavity, and the MEMS electronic component is located within the molded cavity. The base substrate may comprise a laminate substrate. The lid substrate may comprise a cavity port. A base assembly mounting adhesive may couple an inner surface of the lid to a principal surface of the molded ring. The dielectric material may comprise mold material. The molded ring may comprise mold compound adherent to an outer region of an inner surface of the base substrate with a central region of the base substrate exposed by the molded ring.