Molded Circuit Board Assembly for Dual Lens Camera Alignment
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Solution Overview
Problem
Current dual lens camera modules face challenges in ensuring uniform imaging quality due to uncontrollable dimension and position of lens bases, leading to deviations in optical axis alignment, increased size, and contamination of photosensitive chips, which affect image quality and make it difficult to achieve high image quality and thinness.
Innovation Solution
The implementation of a circuit board assembly with a mold sealer that encloses electronic elements, eliminating the need for safety distances and supporting frames, thereby enhancing the rigidity and flatness of the circuit board, reducing size, and preventing contamination, while maintaining precise alignment of optical lenses and photosensitive units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If lens bases are discretely mounted on the circuit board to connect lens bases with each other, then the assembly process is simplified, but the dimension and position of lens bases become hard to control, leading to deviation in optical axis alignment
Solution Approach 1:
The patent merges the lens base assembly with the circuit board by integrating the lens base directly into the circuit board structure. This eliminates the need for separate lens base mounting and connection processes, thereby simplifying the assembly process while ensuring precise optical axis alignment through the integrated design.
Solution Approach 2:
The circuit board is designed to serve multiple functions: it provides electrical connections, structural support, and precise positioning for the lens bases. By making the circuit board multi-functional, the patent eliminates the need for separate mounting structures and ensures consistent dimension and position control for optical axis alignment.
2Strength
If lens motor assemblies are enveloped by supporting frames, then the structural integrity is improved, but the overall size of the camera module increases
Solution Approach 1:
The patent merges the supporting frame function with the circuit board structure. The circuit board itself provides the structural support and enclosure for the lens motor assemblies, eliminating the need for separate supporting frames. This integration maintains structural integrity while reducing the overall camera module size.
Solution Approach 2:
The lens motor assemblies are nested within the circuit board structure, utilizing the existing circuit board space to accommodate the motor assemblies. This nesting approach allows the motor assemblies to be enclosed within the circuit board's structural boundaries, maintaining structural integrity without increasing the overall module size.
3Ease of manufacture
If circuit board is used to connect lens bases, then the assembly process is simplified, but the rigidity of the circuit board is weak, making it easy to be deformed or bent
Solution Approach 1:
The patent employs composite materials in the circuit board construction to enhance its rigidity. By combining different materials with complementary properties, the circuit board achieves both electrical conductivity and enhanced mechanical strength, preventing deformation or bending while maintaining the simplified assembly process.
4Ease of manufacture
If electronic elements are exposed on the circuit board, then the manufacturing process is simplified, but the photosensitive chips are susceptible to contamination
Solution Approach 1:
The patent uses a protective film or shell that covers the photosensitive chips during the manufacturing process. This flexible protective layer prevents contamination of the photosensitive chips while allowing the manufacturing process to proceed with electronic elements exposed on the circuit board. The protective film is removed or adjusted after the critical manufacturing steps.
Data Source
AI summary
An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.