Molded Circuit Board for Camera Module with Integrated Base
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Solution Overview
Problem
Conventional camera module assembly methods limit lighting and thinning performance due to the need for glue-based attachment of components, which increases thickness, exposes electronic components to dust, and lacks suitable packaging for integral semiconductor designs, especially for camera modules requiring precise optical alignment and protection of sensitive elements.
Innovation Solution
A molded circuit board with an integrally formed base that encapsulates electronic components and a photosensitive element, using a manufacturing equipment with a molding mould that includes light window forming blocks and base guide grooves to create a compact, sealed structure without glue, ensuring proper alignment and protection while preventing dust exposure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If glue is used to affix the holder to the circuit board, then the holder can be securely attached, but the thickness of the camera module increases and flatness cannot be guaranteed
Solution Approach 1:
The holder and circuit board are integrated into a single molded structure through injection molding, eliminating the need for separate attachment processes. The molding material directly forms the holder body that is structurally connected to the circuit board, achieving both secure attachment and reduced thickness.
Solution Approach 2:
The mechanical glue-based attachment system is replaced with a molded structural connection system. The holder is formed as an integral part of the molded circuit board assembly, providing mechanical strength through the molded structure itself rather than through adhesive bonding.
2Ease of manufacture
If glue is used for affixing components, then components can be attached, but calibration is complicated and requires preset adjustment spaces
Solution Approach 1:
The holder structure is pre-formed with built-in positioning features during the injection molding process. The molded structure includes predetermined geometric features that automatically position optical components correctly, eliminating the need for post-attachment calibration and adjustment spaces.
Solution Approach 2:
The molded holder structure provides self-aligning features through its geometry, where the molding process itself creates the precise positioning relationships needed for optical alignment. The structure serves its own positioning function without requiring external calibration procedures.
3Productivity
If conventional packaging processes are used, then components can be assembled, but electronic components are exposed to dust and dirt
Solution Approach 1:
The packaging structure is merged with the circuit board assembly through injection molding. The molding material forms an encapsulating structure that seals the electronic components and photosensitive element, creating a dust-proof environment while maintaining assembly capability.
Solution Approach 2:
The molding material forms a encapsulating shell structure that protects the internal components from dust and dirt. This molded shell provides environmental protection while allowing the assembly to be manufactured in a single integrated process.
4Adaptability or versatility
If more glue is preset for calibration adjustment, then adjustment space is provided, but the thickness of the camera module increases
Solution Approach 1:
The molded holder structure incorporates built-in positioning features and adjustment mechanisms during the molding process itself. The geometric design of the molded structure provides the necessary calibration adjustment capability without requiring additional glue layers or preset adjustment spaces that would increase thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a thinner, more reliable camera module with enhanced heat dissipation and strength, improved flatness, and reduced risk of dust contamination, facilitating better calibration and optical alignment while maintaining the integrity of sensitive components.
Implementation Method 1
a molding material filled in the base forming guide groove is solidified from a liquid state to a solid state so as to form a molded base
Data Source
AI summary
A molded circuit board (10) of a camera module (100), manufacturing equipment (200) and a manufacturing method for the molded circuit board. The manufacturing equipment (200) comprises a forming mold (210), which comprises a first mold (211) and a second mold (212) that can be opened or closed, where the first mold (211) and the second mold (212) form a forming cavity (213) when closed. Also, a light window forming block (214) and a base forming guide groove (215) located at the periphery of the light window forming block (214) are provided within the forming cavity (213). When a circuit board is mounted in the forming cavity (213), once a molding material (13) filled into the base forming guide groove (215) is solidified into form by undergoing a transition process from a liquid state to a solid state, a molded base (12) is formed at the position corresponding to the base forming guide groove (215), a through hole of the molded base (12) is formed at the position corresponding to the light window forming block (214), where the molded base (12) is integrally formed on the circuit board so as to form the molded circuit board (10) of the camera module (100). The through hole is used for providing the camera module (100) with an optical path. The molded base (12) can serve as a frame for the camera module (100).