Molded Circuit Board Layout for Uniform Display Appearance
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Solution Overview
Problem
Existing electronic devices face issues with non-uniform product appearance and optical performance due to gaps and bubbles between circuit boards, which affect the overall aesthetic and functional quality.
Innovation Solution
The implementation of a molding material that covers and fills the gaps between circuit boards, along with the use of fillers and spacers to ensure uniformity and protection of semiconductor elements, enhancing the product's appearance and optical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If circuit boards are arranged adjacent to each other on the supporting board, then the device integration density is improved, but gaps and bubbles form between circuit boards causing non-uniform appearance and optical performance defects
Solution Approach 1:
A molding material is introduced as an intermediary substance between adjacent circuit boards. This molding material fills the gaps that would otherwise remain between the circuit boards, eliminating the harmful effects of gaps and bubbles while maintaining the high integration density arrangement. The molding material acts as a mediator that preserves both the dense packing and the uniform appearance.
2Productivity
If circuit boards are arranged adjacent to each other on the supporting board, then the device integration density is improved, but optical performance defects occur due to gaps and bubbles between circuit boards
Solution Approach 1:
The molding material serves as an intermediary that eliminates optical performance defects by filling gaps between circuit boards. This mediator prevents light scattering and reflection issues that would otherwise occur at the interfaces between adjacent circuit boards, thereby maintaining both high integration density and reliable optical performance.
3Ease of manufacture
If gaps exist between circuit boards, then manufacturing simplicity is maintained, but product appearance uniformity deteriorates
Solution Approach 1:
The molding material is introduced as a simple intermediary that fills gaps between circuit boards during the manufacturing process. This approach maintains the simplicity of the manufacturing process while simultaneously achieving uniform appearance, as the molding material can be applied in a straightforward manner to fill all gaps between adjacent circuit boards.
Data Source
AI summary
An electronic device is provided. The electronic device includes a supporting board, multiple circuit boards, a gap, and a molding material. The circuit boards are disposed on the supporting board. Each circuit board includes a substrate and multiple semiconductor elements. The semiconductor elements are disposed on the substrate. The gap is disposed between two adjacent circuit boards. The molding material is disposed on the supporting board and covers the circuit boards and the gap. The electronic device of the embodiment of the disclosure can improve uniformity of product appearance or uniformity of a display image.