Integrally Molded Coil With Conductive Coating for Cooling and EMI Shielding
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Solution Overview
Problem
Conventional power conversion devices for electric vehicles face challenges in downsizing due to the need for separate heat dissipation and electromagnetic shielding structures, which complicates the integration and increases the device's size.
Innovation Solution
An integrally-molded coil is formed by molding a resin material with electrical insulation and thermal conductivity around a coil portion, combined with a metal coating on the outer surface for electromagnetic shielding, allowing for simplified manufacturing and combined heat dissipation and shielding functions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate heat dissipation structure and electromagnetic wave shielding structure are provided, then cooling and electromagnetic shielding functions are achieved, but device size increases and integration becomes complicated
Solution Approach 1:
The patent combines the heat dissipation structure and electromagnetic wave shielding structure into a single integrated component. The housing simultaneously performs both functions: its metallic structure provides electromagnetic shielding while its design with heat dissipation ports and connection to cooling members enables thermal management. This eliminates the need for separate structures, reducing device complexity and improving integration.
Solution Approach 2:
The housing is designed as a multi-functional component that serves multiple purposes: structural support, electromagnetic shielding, and heat dissipation. By making the housing universal and capable of performing both shielding and cooling functions, the patent reduces the number of components needed and simplifies the overall device architecture.
2Reliability
If separate heat dissipation structure and electromagnetic wave shielding structure are provided, then cooling and electromagnetic shielding functions are achieved, but device size increases
Solution Approach 1:
The patent merges the heat dissipation structure and electromagnetic wave shielding structure into a single integrated housing component. This combination eliminates the need for separate structures that would occupy additional space, thereby reducing the overall device volume while maintaining both cooling and shielding functions.
Solution Approach 2:
By designing the housing as a multi-functional component that simultaneously provides electromagnetic shielding and heat dissipation capabilities, the patent reduces the total device size. The housing serves multiple purposes, eliminating redundant structures and optimizing space utilization.
3Reliability
If resin material with electrical insulation and thermal conductivity is used, then electrical insulation and heat dissipation are achieved, but manufacturing complexity increases
Solution Approach 1:
The patent specifies particular parameter ranges for the resin material, including thermal conductivity (0.3 W/m·K or more) and electrical resistance (10^12 Ω or more). By defining these parameters, the patent balances the competing requirements of heat dissipation and electrical insulation, enabling the use of standard molding processes while achieving the desired functional performance.
Solution Approach 2:
The patent employs composite material construction by combining resin with metallic components (such as metal plates or meshes) to achieve both electrical insulation and heat dissipation properties. This composite approach allows the housing to meet functional requirements while remaining manufacturable using conventional techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables effective cooling and electromagnetic shielding without the need for large-scale structures, reducing component count and simplifying the internal design, while maintaining efficient heat dissipation and shielding performance.
Implementation Method 1
molding a resin material having electrical insulation and thermal conductivity
Implementation Method 2
an outer surface of the resin portion is applied with a surface treatment for imparting electrical conductivity
Data Source
AI summary
An integrally-molded coil according to the present disclosure includes a coil portion and a resin portion. The resin portion is formed by molding a resin material having electrical insulation and thermal conductivity using the coil portion as an insert. The coil portion includes a coil main body and one or more pairs of leads each extending from the coil main body to an outside of the resin portion. An outer surface of the resin portion is applied with a surface treatment for imparting electrical conductivity, and is insulated from the one or more pairs of leads.