Molded Communications Module with Integrated Plastic Circuit Structures
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Solution Overview
Problem
Traditional optical transceiver modules are complex and have a high part count, which complicates design and reduces reliability due to the use of multiple components and interconnections.
Innovation Solution
A communications module with a molded body made of plastic resin, featuring conductive traces and contact pads, and integrated optical subassemblies, eliminating the need for a printed circuit board, and using laser direct structuring for conductive feature formation, allowing for simplified design and reduced part count.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional optical transceiver modules use multiple components including printed circuit boards and separate optical subassemblies, then the modules can be assembled with proven components, but the part count increases and design complexity increases
Solution Approach 1:
The patent combines the printed circuit board, optical subassemblies, and housing into a single integrated molded component. Conductive traces and contact pads are directly formed on the molded body surface, eliminating the need for separate PCB and reducing the number of interconnections between components.
2Ease of manufacture
If traditional optical transceiver modules use printed circuit boards with electronic circuitry, then the modules can provide electrical connections, but the number of interconnections increases and design simplification is limited
Solution Approach 1:
The patent extracts the printed circuit board function from the traditional module architecture and integrates it directly into the molded body. Conductive traces are formed directly on the molded surface, eliminating the intermediary PCB layer and reducing design complexity.
3Reliability
If traditional optical transceiver modules use separate components and interconnections, then the modules can be assembled with standard components, but signal transmission efficiency decreases and electromagnetic interference increases
Solution Approach 1:
The patent merges the signal path into a single integrated structure where conductive traces are directly formed on the molded body. This eliminates multiple interconnection interfaces between separate components, reducing signal loss and electromagnetic interference along the transmission path.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a more stable, efficient, and cost-effective optical transceiver module with improved signal transmission and reduced electromagnetic interference, enabling high-volume production and enhanced design flexibility.
Implementation Method 1
laser direct structuring for conductive feature formation
Data Source
AI summary
An embodiment disclosed herein relates to a communications module. The communications module includes a body composed of a plastic resin and a plurality of conductive traces and contact pads defined on a portion of a surface of the body. The module also includes at least one substantially vertical ridge defined on the body surface, and at least one pocket defined on the body suitable for receiving an electronic component. The communications module may also include a body composed of a plastic resin and conductive features defined on a surface of the body configured to render the communications module operable without implementing a printed circuit board as part of the body. Additional embodiments relate to systems and methods for attaching one or more optical transmit assemblies to the communications module and for electrically connecting conductive traces in a temporary fashion on the surface of the body of the communications module.