Molded Composite Enclosure for IC Assembly Thermal Management

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Solution Overview

Problem

Current enclosures for electronic assemblies, such as solid-state drives, made from cast metal are costly, have higher mass or lower stiffness, require cosmetic finishing, and do not allow for screwless designs or efficient thermal dissipation.

Innovation Solution

A molded composite enclosure with a polymer interior and metal exterior, formed through a molding process, which provides a contiguous structure for thermal coupling and integrates screwless fastening mechanisms, reducing thickness and weight while enhancing thermal dissipation and manufacturing efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If cast metal structures are used for enclosures, then structural strength is achieved, but mass increases and stiffness decreases

Engineering Contradiction:

Improvestructural strengthVSAvoidenclosure mass

Core Design Contradiction:

StrengthVSWeight of stationary object

Solution Approach 1:

The patent applies composite materials by combining a polymer interior portion with a metal exterior portion in a molded lid structure. The metal exterior (aluminum, stainless steel, or titanium) provides structural strength and thermal dissipation, while the polymer interior provides structural support with lower density. This composite approach resolves the contradiction by achieving required strength while reducing overall enclosure mass compared to solid metal constructions.

Inventive Principle:

Principle #40Composite materials

2Strength

If cast metal structures are used for enclosures, then structural strength is achieved, but manufacturing cost increases

Engineering Contradiction:

Improvestructural strengthVSAvoidmanufacturing cost

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The composite molded structure combines polymer and metal materials in a single integrated component. The polymer portion can be manufactured using cost-effective injection molding processes, while the metal exterior provides necessary strength. This approach reduces manufacturing cost compared to traditional cast metal enclosures that require expensive tooling, post-processing, and assembly operations.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent merges multiple functions into a single molded lid structure: the polymer interior portion and metal exterior portion are formed as one integrated component. This consolidation eliminates the need for separate manufacturing and assembly steps, reducing overall manufacturing cost while maintaining structural integrity.

Inventive Principle:

Principle #5Merging (Combining)

3Strength

If cast metal structures are used for enclosures, then structural strength is achieved, but thermal dissipation efficiency decreases

Engineering Contradiction:

Improvestructural strengthVSAvoidthermal dissipation efficiency

Core Design Contradiction:

StrengthVSTemperature

Solution Approach 1:

The composite structure utilizes the metal exterior portion (aluminum, stainless steel, or titanium) as a thermal management component. These metals have high thermal conductivity and are positioned to contact the IC assembly, providing efficient heat pathways. The polymer interior provides structural support without compromising the thermal performance, as heat is conducted away through the metal exterior surfaces.

Inventive Principle:

Principle #40Composite materials

4Productivity

If traditional molding processes are used, then manufacturing efficiency is achieved, but integration of fastening features is limited

Engineering Contradiction:

Improvemanufacturing efficiencyVSAvoidintegration of fastening features

Core Design Contradiction:

ProductivityVSAdaptability or versatility

Solution Approach 1:

The patent integrates screwless fastening mechanisms directly into the molded lid structure. The polymer interior portion can incorporate molded-in features such as recesses, protrusions, or interference-fit elements that enable tool-less attachment to the base structure. This integration maintains high manufacturing efficiency through single-step molding while providing versatile fastening capabilities without requiring separate components or assembly steps.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The molded composite enclosure offers improved stiffness, reduced mass, cost savings, and efficient thermal management, allowing for thinner designs and eliminating the need for post-cosmetic finishing, while enabling screwless attachment and enhanced thermal performance.

Implementation Method 1

the IC assembly can be thermally coupled with the contiguous exterior material through the opening

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP3143643B1Molded composite enclosure for integrated circuit assembly

Publication Date: 2022.06.01 INTEL CORP

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AI summary

Embodiments of the present disclosure are directed toward a molded composite enclosure for an integrated circuit (IC) assembly. In one embodiment, an enclosure for an integrated circuit (IC) assembly may include a molded lid structure having a body portion, and a side portion that extends from the body portion and forms a cavity configured to house the IC assembly, wherein the body portion and the side portion share a contiguous interior material comprising a polymer and share a contiguous exterior material comprising a metal, the contiguous interior material having an opening formed in the body portion such that the IC assembly can be thermally coupled with the contiguous exterior material through the opening. Other embodiments may be described and/or claimed.