Integrated Battery Package Structure for Heat and Swelling Stress

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Solution Overview

Problem

Existing methods for integrating batteries with integrated circuits face challenges such as bulk addition, reduced reliability, complexity in manufacturing, and battery degradation due to high temperatures during assembly processes, as well as mechanical stresses from battery swelling.

Innovation Solution

A device package design that integrates a battery within a molded cover, using conductive leads and low-temperature bonding agents to secure the battery terminals to the substrate, allowing assembly at lower temperatures and enabling panel-level manufacturing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If batteries are externally mounted via sockets, tabs or clips after fabrication, then installation is simple, but device complexity and manufacturing complexity increase

Engineering Contradiction:
Improvebattery installation simplicityVSAvoidmounting assembly complexity
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The battery is integrated directly into the molded package structure, merging the battery mounting function with the package encapsulation. The conductive leads are embedded within the molded cover during the molding process, eliminating the need for separate mounting assemblies like sockets, tabs, or clips. This integration reduces device complexity while maintaining ease of manufacture.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The molded cover serves multiple functions: it provides mechanical protection for the battery, embeds the conductive leads for electrical connection, and integrates the battery mounting function all in one component. This multi-functionality reduces the number of separate components needed, thereby reducing device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Ease of manufacture

If traditional assembly processes are used, then manufacturing is straightforward, but batteries degrade due to high temperatures and mechanical stresses

Engineering Contradiction:
Improveassembly process simplicityVSAvoidbattery reliability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The assembly process uses lower temperatures compared to traditional semiconductor manufacturing processes. By changing the temperature parameter to be lower, the battery is protected from thermal degradation while still allowing the molding material to be properly formed and bonded.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The battery is positioned and secured within the molded cover before the final encapsulation step. The molded cover is designed to accommodate the battery's physical dimensions and provide mechanical support, cushioning the battery against subsequent mechanical stresses during handling and operation.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

3Device complexity

If batteries are integrated within the molded cover, then manufacturing complexity is reduced, but the molded cover must accommodate additional components

Engineering Contradiction:
Improvemanufacturing process complexityVSAvoidmolded cover design complexity
Core Design Contradiction:
Device complexityVSEase of manufacture

Solution Approach 1:

The battery is positioned in a cavity formed within the molded cover structure, utilizing the three-dimensional space available in the package. This spatial arrangement allows the battery to be integrated without significantly increasing the planar footprint, and the molded cover design incorporates the battery compartment as an inherent feature rather than an add-on.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

4Productivity

If high-volume assembly is implemented, then productivity increases, but manufacturing precision requirements increase

Engineering Contradiction:
Improveassembly volumeVSAvoidbattery positioning precision
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The conductive leads are embedded within the molded cover during the molding process itself, before the battery is installed. This preliminary action establishes the electrical connection pathways in advance, so that when batteries are installed in high-volume assembly, the positioning precision requirement is reduced because the leads are already in place and the battery simply needs to be connected to the pre-positioned leads.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS20250210545A1Device packages with integrated batteries
Publication Date: 2025.06.26 NXP USA INC
  • US20250210545A1 patent drawing
  • US20250210545A1 patent drawing
  • US20250210545A1 patent drawing

AI summary

Electronic device packages that allow batteries to be incorporated in the package directly above or below semiconductor die or other devices can enable reduced package footprints while also protecting batteries against exposure to undesirable high temperatures during assembly of the package and protecting molded portions of the package from stresses that may arise from swelling of the battery over its useful lifetime. One terminal of the battery is bonded a conductive lead integrated within a molded cover by an electrically conductive bond. Bonding the cover to a circuit board or other substrate also electrically couples to battery terminal to a contact on the substrate. The other terminal of the batter can be bonded to another contact on the substrate using a suitable conductive bond such as one formed by an electrically conductive adhesive.