Molded Controller Die Assembly Without Memory Stack Supports

Solution Overview

Problem

Semiconductor die assemblies face challenges with support structures that obstruct encapsulating material flow, lead to uneven stress, and reliability issues, while consuming equipment capacity and increasing manufacturing complexity.

Innovation Solution

Eliminating support structures by forming mold structures around the controller die, which provides a level surface for attaching memory dies and facilitates robust encapsulation, allowing for flexible signal routing and improved manufacturing efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If support structures are used to attach semiconductor dies, then mechanical support is provided, but encapsulating material flow is obstructed and uneven stress occurs

Engineering Contradiction:

Improvemechanical supportVSAvoidencapsulation quality

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The patent removes support structures from the semiconductor die assembly. Instead of using separate support structures to provide mechanical support, the mold compound itself is used to provide the necessary support while enabling proper encapsulation material flow and stress distribution.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent combines the support function with the mold compound. The mold compound serves dual purposes: it provides mechanical support for the semiconductor dies and enables proper encapsulation, eliminating the need for separate support structures.

Inventive Principle:

Principle #5Merging (Combining)

2Strength

If support structures are used to attach semiconductor dies, then mechanical support is provided, but reliability issues arise

Engineering Contradiction:

Improvemechanical supportVSAvoidassembly reliability

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The patent removes support structures from the semiconductor die assembly. Instead of using separate support structures to provide mechanical support, the mold compound itself is used to provide the necessary support while enabling proper encapsulation material flow and stress distribution.

Inventive Principle:

Principle #2Taking out (Extraction)

3Device complexity

If support structures are used, then equipment capacity is consumed and manufacturing complexity increases, but productivity decreases

Engineering Contradiction:

Improvemanufacturing complexityVSAvoidmanufacturing efficiency

Core Design Contradiction:

Device complexityVSProductivity

Solution Approach 1:

The patent removes support structures from the semiconductor die assembly. Instead of using separate support structures to provide mechanical support, the mold compound itself is used to provide the necessary support while enabling proper encapsulation material flow and stress distribution.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent combines the support function with the mold compound. The mold compound serves dual purposes: it provides mechanical support for the semiconductor dies and enables proper encapsulation, eliminating the need for separate support structures.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS20230268327A1Semiconductor die assemblies with molded semiconductor dies and associated methods and systems

Publication Date: 2023.08.24 MICRON TECHNOLOGY INC

AI summary

Semiconductor die assemblies with molded semiconductor dies, and associated methods and systems are disclosed. In some embodiments, a semiconductor die assembly includes a package substrate and a controller die attached to the package substrate. The semiconductor die assembly comprises a mold structure including the controller die and having a surface facing away from the package substrate. The controller die may be completely encased within the mold structure. Further, one or more stacks of semiconductor dies (e.g., memory dies) are attached to the surface of the mold structure. Accordingly, the semiconductor die assembly does not include support structures for the stacks of semiconductor dies attached above the controller die.