Molded EMI Shield with Metal Frame for Thermal Management
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Solution Overview
Problem
Electronic components face challenges with electromagnetic interference (EMI) and radio frequency interference (RFI) emissions, which can lead to regulatory issues and erratic behavior due to heat dissipation problems, and traditional metal shields increase product size to address these issues.
Innovation Solution
A low-profile shield system combining a silicone shield with a metal frame and heat sink, featuring a cavity and slit design that directly contacts the electronic component for effective EMI/RFI reduction and heat dissipation, potentially incorporating additives like copper, zinc, or nickel for enhanced performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal shield is used to control EMI and RFI emissions, then EMI and RFI emissions are reduced, but the product size increases due to required air circulation space
Solution Approach 1:
The patent combines the EMI/RFI shielding function with the thermal management function into a single integrated shield structure. The shield directly contacts the electronic component to provide electromagnetic shielding while simultaneously conducting heat away from the component, eliminating the need for separate air circulation space and reducing overall product size.
Solution Approach 2:
The patent changes the thermal management approach from convection-based (air circulation) to conduction-based (direct thermal contact). By using thermally conductive materials in the shield that directly contact the electronic component, heat is conducted through the shield to external heat sinks, allowing for a more compact design without sacrificing thermal management effectiveness.
2Object-affected harmful factors
If a metal shield is used to reduce EMI and RFI emissions, then electromagnetic interference is controlled, but heat dissipation efficiency decreases due to blocked air circulation
Solution Approach 1:
The shield integrates both EMI/RFI shielding and heat dissipation functions. The same structure that blocks electromagnetic interference also serves as a thermal conduction path, with thermally conductive materials directly contacting the electronic component to conduct heat away while maintaining electromagnetic shielding effectiveness.
Solution Approach 2:
The patent replaces the convection-based thermal management system (air circulation) with a conduction-based system. Thermal conduction through the shield structure substitutes for convective heat transfer through air, allowing the shield to simultaneously block EMI/RFI and efficiently conduct heat away from the electronic component.
3Temperature
If air circulation space is provided for heat dissipation, then heat dissipation is improved, but the shield profile increases
Solution Approach 1:
The patent changes the heat dissipation mechanism from convection (requiring air circulation space) to conduction (requiring direct thermal contact). This parameter change allows the shield to maintain a low profile while effectively dissipating heat through direct thermal conduction paths to external heat sinks.
Solution Approach 2:
The patent shifts the heat dissipation approach from utilizing vertical air circulation space to utilizing lateral thermal conduction paths. Heat is conducted through the shield structure to side-mounted or top-mounted heat sinks, eliminating the need for vertical clearance and enabling a low-profile design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The shield system effectively reduces EMI and RFI emissions while providing efficient heat dissipation, maintaining component functionality in a compact form factor, thus addressing size and regulatory compliance concerns.
Implementation Method 1
a metal layer arranged to conform to the top side of the silicone shield, wherein the metal layer may be disposed in direct contact with the top side of the silicone shield... the midplate may include a heat sink
Implementation Method 2
a silicone shield... The shield may include a top side and a bottom side, disposed on the electrical component... the silicone shield body may include additives to increase the ability to reduce interference... at least one of a copper additive, a zinc additive, and a nickel additive
Data Source
AI summary
One embodiment of a molded shield can include a cavity to conform to and receive an electrical component, a slit to conform to and receive a metal frame and a metal layer coupled to the top and lateral sides of the molded shield. In one embodiment, the molded shield can be formed from silicon and can include material to enhance electrical conductivity. The molded shield can couple to the metal frame which in turn can be coupled to ground with the resulting configuration acting to reduce electrical emissions. The molded shield can transfer heat away from the electrical component through conduction.