Low-Pressure Molded Enclosure With Support Seal Flow Control
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Solution Overview
Problem
Low pressure molding processes face challenges in controlling the flow and position of fragile electronic components within articles, leading to potential damage from environmental factors and cosmetic defects due to wall features in the mold or frame.
Innovation Solution
Incorporation of support seals with specific geometries that fit snugly within the enclosure voids to control the flow of low pressure mold material and stabilize electronic components, while allowing for precise positioning and assembly without costly mold modifications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If low pressure molding is used to encapsulate electronics, then protection from environmental factors is improved, but control of material flow and component positioning deteriorates
Solution Approach 1:
A support seal acts as an intermediary component between the low pressure mold material and the electronic component. The seal receives and directs the mold material flow, preventing uncontrolled material from contacting the electronic component, thereby maintaining both protection reliability and manufacturing precision
Solution Approach 2:
The molding process is segmented into controlled zones using the support seal. The seal creates distinct regions for mold material flow and electronic component placement, allowing independent control of material injection and component positioning without interference
2Manufacturing precision
If wall features are added to the mold or frame to control material flow, then manufacturing precision is improved, but device complexity and cost increase
Solution Approach 1:
The flow control function is extracted from the mold or frame structure and implemented as a separate, removable support seal component. This eliminates the need for permanent mold modifications while maintaining precise material flow control
Solution Approach 2:
The support seal is a simple, inexpensive component that can be easily manufactured and replaced if needed, avoiding costly and complex mold modifications. The seal performs its flow control function effectively without requiring permanent changes to the molding system
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The support seals effectively encapsulate and protect electronic components from environmental factors while maintaining component position and preventing cosmetic defects, facilitating efficient assembly and reducing material waste.
Implementation Method 1
A low pressure mold material is injected into the first section of the void and cured around a first segment of the electronic component to encapsulate the first segment of the electronic component
Implementation Method 2
The temperature of the injected hot melt material is high enough that the hot melt material has a low viscosity and can flow easily around the electronics
Implementation Method 3
After the hot melt material flows around the electronics, it quickly cools and hardens. The cooled material encapsulates the electronics to protect them
Data Source
AI summary
An article includes a hollow enclosure defining a void. The void has a first section and a second section separate from the first section. An electronic component is housed in the first section and the second section of the void. A low pressure mold material is molded into the first section of the void and cured around a first segment of the electronic component to encapsulate the first segment of the electronic component. A support seal is inserted into the second section of the void adjacent a second segment of the electronic component. The support seal defines a sealing barrier on one side of the low pressure mold material that limits the flow of low pressure mold material out of the first section of the void.