Molded Etch Masks for LED Light Collimation

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Solution Overview

Problem

Conventional techniques for shaping etch masks, such as thermal reflow, are difficult to control, leading to inconsistencies in fabricating semiconductor devices with desired shapes, particularly for LEDs, which affects the efficiency and consistency of light collimation and directionalization.

Innovation Solution

The use of molded etch masks formed by pressing a mold against a pliable masking material applied to an epitaxial layered structure, allowing for precise formation of mesa-shaped structures and optical elements like lenses or diffraction gratings, which are then used to etch the semiconductor devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Shape

If thermal reflow is used to shape etch masks, then the masks can be formed into desired shapes, but the process becomes difficult to control and inconsistent

Engineering Contradiction:

Improvemask shapeVSAvoidfabrication consistency

Core Design Contradiction:

ShapeVSManufacturing precision

Solution Approach 1:

The mold is prepared in advance with the precise negative shape of the desired mask pattern. By pressing this pre-formed mold against the masking material, the mask is shaped with high precision without requiring thermal reflow processes, thereby eliminating control difficulties and inconsistency

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent replaces the thermal reflow process (thermal field) with a mechanical pressing process using a mold. This mechanical approach provides direct shape transfer with better control and consistency, eliminating the difficulties associated with thermal process control

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Shape

If thermal reflow is used to shape etch masks, then masks can be formed, but fabrication efficiency decreases due to control difficulties

Engineering Contradiction:

Improvemask shapeVSAvoidfabrication efficiency

Core Design Contradiction:

ShapeVSProductivity

Solution Approach 1:

The mold is pre-formed with the exact desired mask pattern, allowing direct shape transfer in a single pressing step. This eliminates the need for iterative thermal reflow adjustments, significantly improving fabrication efficiency while maintaining shape accuracy

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

Replacing the complex thermal reflow process with a simple mechanical pressing operation reduces process time and improves fabrication efficiency. The mechanical mold pressing can be performed quickly and consistently without the extended thermal processing and monitoring required by reflow methods

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS10910514B1Molded etch masks

Publication Date: 2021.02.02 META PLATFORMS TECHNOLOGIES LLC

AI summary

Techniques related to molded etch masks are disclosed. Etch masks can be formed based on pressing a mold against a layer of pliable masking material applied to a surface of an epitaxial layered structure. The epitaxial layered structure includes a first semiconductor layer, a second semiconductor layer, and a light-emitting layer between the first and second semiconductor layers. The epitaxial layered structure is etched using the molded etch masks to form etched structures. The etched structures may be optical structures that modify light emitted through the surface or epitaxial mesas that collimate light within the epitaxial layered structure.