Molded Housing for Optical MEMS Alignment and Protection
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Solution Overview
Problem
Current MEMS device packaging is inefficient in terms of space and volume, particularly for biomedical imaging applications, as it requires large planar packages that are not suitable for complex geometries and are sensitive to environmental factors like static and moisture, limiting the miniaturization of optical MEMS devices.
Innovation Solution
A low-cost molded housing that provides precise alignment, mechanical protection, optical imaging windows, and electrical connections, integrated with the MEMS device for structural integrity, using techniques such as spring contacts, wirebonding, and flexible substrates to minimize space and enhance assembly efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional planar packaging is used for MEMS devices, then electrical and optical connections can be established, but the device occupies large space and volume
Solution Approach 1:
The patent combines multiple packaging functions (protection, alignment, electrical connection, optical connection) into a single integrated package structure. The package housing simultaneously provides mechanical protection for the MEMS device, alignment features for optical components, and integrated electrical contacts, eliminating the need for separate PCBs and multiple mounting boards.
Solution Approach 2:
The package structure serves multiple functions: it protects the MEMS device from environmental damage, provides precise alignment for optical components, establishes electrical connections through integrated contacts, and enables optical signal transmission through windows. This multi-functional design reduces the overall system volume while maintaining all necessary connections.
2Ease of manufacture
If PCB mounting is used for electrical connections, then signal routing is provided, but the device size increases and complex geometry is not achieved
Solution Approach 1:
The patent integrates electrical connection functionality directly into the package housing structure, eliminating the need for separate PCB mounting. Conductive elements are incorporated into the package itself, allowing signal routing to be achieved within the compact package geometry rather than requiring external circuit boards.
3Reliability
If wirebonding is used to connect MEMS devices, then electrical connections are established, but large space and vertical clearance are required
Solution Approach 1:
The patent replaces the mechanical wirebonding process with direct electrical contacts integrated into the package structure. Instead of requiring wirebonds that need vertical clearance and large area for routing, the invention uses direct contact elements (such as spring contacts or conductive posts) that establish electrical connections with minimal space requirements.
4Object-affected harmful factors
If standard packaging methods are used, then MEMS devices are protected, but alignment precision and optical performance are compromised
Solution Approach 1:
The patent integrates alignment features directly into the package housing structure. Precision mechanical features such as recesses, protrusions, and keyed interfaces are built into the package to ensure accurate positioning of the MEMS device and optical components, combining protection and alignment functions in a single integrated structure.
Data Source
AI summary
A method and apparatus for constructing MEMS devices is provided which employs a low cost molded housing that simultaneously provides precise and accurate alignment, mechanical protection, electrical connections and structural integrity for mounting optical and MEMS components. The package includes a MEMS die mounting surface, an optical component mounting surface and an optical imaging window monolithically fabricated with the MEMS die mounting surface in a predetermined orientation for providing alignment between the MEMS die and optical components. A MEMS adaptor plate is provided to facilitate connections of a MEMS die to external components.