Molded Image Sensor Package with Cavity Walls and RDL Encapsulation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing image sensor chip scale packages face challenges in providing effective protection against mechanical damage and moisture ingress, particularly at the intersections between interconnects and redistribution layers, while maintaining efficient signal communication and device functionality.
Innovation Solution
A molded image sensor chip scale package design featuring a redistribution layer coupled to the image sensor, with a transparent layer and cavity walls forming a cavity, and a mold material encapsulating portions of the redistribution layer, interconnects, and the transparent layer, extending along the redistribution layer and cavity walls to form a protective layer perpendicular to the image sensor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a molded package structure is used to protect the image sensor, then mechanical damage and moisture protection is improved, but the complexity of the package structure increases
Solution Approach 1:
The package structure is divided into distinct functional components: cavity walls forming a protective enclosure, a transparent layer allowing light transmission, and mold material providing environmental protection. This segmentation allows each component to be optimized for its specific function while simplifying the overall manufacturing process through modular assembly
Solution Approach 2:
The package employs a nested structure where the image sensor is positioned within a cavity formed by cavity walls, which are in turn enclosed by mold material. The transparent layer is integrated within this nested structure, creating a multi-layer protective system that protects the sensor while maintaining optical access
2Reliability
If mold material encapsulates the redistribution layer and interconnects, then protection against moisture and mechanical damage is improved, but manufacturing precision requirements increase
Solution Approach 1:
The cavity walls are formed and positioned around the image sensor before the mold material is applied. This preliminary structuring creates defined boundaries and channels that guide the mold material flow, ensuring complete encapsulation of the redistribution layer and interconnects without requiring ultra-precise control during the molding process
Solution Approach 2:
The cavity walls serve as an intermediary structure between the image sensor and the mold material. These walls create a controlled interface that manages the encapsulation process, directing mold material to properly cover critical areas like the intersections between interconnects and redistribution layers while maintaining manufacturing feasibility
Data Source
AI summary
Implementations of a molded image sensor chip scale package may include an image sensor having a first side and a second side. A first cavity wall and a second cavity wall may be coupled to the first side of the image sensor and extend therefrom. The first cavity wall and the second cavity wall may form a cavity over the image sensor. A transparent layer may be coupled to the first cavity wall and the second cavity wall. A redistribution layer (RDL) may be coupled to the second side of the image sensor. At least one interconnect may be directly coupled to the RDL. A mold material may encapsulate a portion of the RDL, a portion of the image sensor, and a side of each cavity wall, and a portion of the transparent layer.