Molded Power Inductor Assembly With Gapless Core Fit

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Traditional power inductor manufacturing processes face issues such as virtual welding, open circuits, short circuits, deformation of conductors under high pressure, insufficient adhesive force between magnetic particles, and inefficient use of magnetic core volume due to gaps and high production costs, especially in miniaturization and thinning trends.

Innovation Solution

A molded-forming power inductor design featuring a conductor with an integrally formed insulation-processed base and side parts assembled gaplessly with a magnetic core, wrapped in a magnetic molding package layer, using a lower forming pressure and a method that includes prefabricating the conductor and magnetic core, and applying a molded-forming process with an organic layer cured by baking, ensuring a gapless fit and high bonding force.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If high pressure (900 MPa or above) is applied in compression molding forming process, then the coil and welding spot can be manufactured, but the welding spot, coil film and magnetic powder insulating layer are easily damaged causing open circuit and short circuit

Engineering Contradiction:
Improvewelding spot integrityVSAvoidcoil and insulating layer integrity
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The conductor is pre-assembled with the magnetic core in a gapless fit mode before the compression molding process. The coil is positioned and secured on the magnetic core with precise alignment features (groove bodies and positioning structures) prepared in advance, so that during compression molding the conductor and magnetic core are already in correct positional relationship, eliminating the need for high pressure to create the fit and reducing damage risk to welding spots and insulating layers

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent changes the pressure parameter from traditional high pressure (900 MPa or above) to lower pressure (below 900 MPa) in the compression molding process. This parameter change is made possible by the pre-assembled gapless fit structure, which maintains manufacturing precision while reducing the harmful effects of high pressure on welding spots, coil film, and insulating layers

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If high pressure is applied in compression molding, then the conductor can be formed, but the conductor is deformed

Engineering Contradiction:
Improveconductor formationVSAvoidconductor deformation
Core Design Contradiction:
Manufacturing precisionVSShape

Solution Approach 1:

The conductor is pre-formed and pre-assembled with the magnetic core before compression molding. The base part, side enclosing parts, and electrode parts are already shaped and positioned correctly in advance, so the compression molding process only needs to secure the assembly rather than form the conductor shape, preventing deformation

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The pressure parameter is reduced from traditional high pressure to below 900 MPa, which is sufficient to secure the pre-formed conductor assembly without causing deformation. The lower pressure maintains the conductor's shape while still achieving the necessary bonding and assembly fixation

Inventive Principle:
Principle #35Parameter changes

3Ease of manufacture

If electrodes are led out from two sides of the magnet with side electrodes positioned outside the magnet, then the inductor can be manufactured, but the volume of the magnet cannot be fully utilized

Engineering Contradiction:
Improveelectrode configurationVSAvoidmagnetic core volume utilization
Core Design Contradiction:
Ease of manufactureVSVolume of stationary object

Solution Approach 1:

The electrode parts are arranged in a planar configuration on the same plane as the magnetic core's lower surface, with electrodes extending from opposite sides. This two-dimensional layout optimizes space utilization by keeping electrodes coplanar with the core rather than extending beyond it in three-dimensional space, maximizing the magnetic core's volume utilization while maintaining manufacturability

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

4Ease of manufacture

If traditional combined magnetic core type power inductor with ferrite magnetic core and gap between conductor and magnetic core is used, then the inductor can be manufactured, but the leakage magnetic flux is large and it is easy to produce sound

Engineering Contradiction:
Improvemagnetic core assemblyVSAvoidleakage magnetic flux and sound
Core Design Contradiction:
Ease of manufactureVSObject-generated harmful factors

Solution Approach 1:

The conductor's base part and side enclosing parts are assembled with the magnetic core in a gapless fit mode, merging the conductor and magnetic core into a tightly integrated assembly. The gapless fit eliminates air gaps between the conductor and magnetic core, preventing leakage magnetic flux and the associated sound generation, while still allowing for ease of manufacture through pre-formed components and positioning features

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces leakage magnetic flux, enhances space utilization, maintains high inductance and current performance, and increases reliability by eliminating gaps and deformations, while allowing for miniaturization and high-frequency noise reduction.

Implementation Method 1

an organic layer of the magnetic molding package layer is cured by baking over 100° C. for 1 hour or more

Methodology Applied
Scientific EffectBaking curing: Heat Treatment

Data Source

PatentUS20240412920A1Manufacturing method of molded-forming power inductor
Publication Date: 2024.12.12 SHENZHEN SUNLORD ELECTRONICS
  • US20240412920A1 patent drawing
  • US20240412920A1 patent drawing
  • US20240412920A1 patent drawing

AI summary

A method is provided for manufacturing the molded-forming power inductor. The molding package layer completely covers the prefabricated magnetic core and a part of the conductor except the electrode, the structure is integrally formed, and the leakage magnetic flux is less; when the equivalent magnetic permeability is 60 or more, the equivalent saturation magnetic flux density can be 0.55T or higher; and the space utilization rate is high to facilitate miniaturization of an inductor design.