One-Piece Molded Information Carrier Security Against Tampering
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Solution Overview
Problem
Existing information carriers, such as USB keys, lack adequate security measures to prevent tampering and falsification, especially when used in secure applications where a secure microcontroller is involved, as they can be easily dismantled to alter the graphic personalization elements.
Innovation Solution
A method of manufacturing an information carrier with a one-piece molded outer casing that encloses the microcircuit and a securely integrated security element, such as a hologram or secure ink, making it impossible to replace or falsify without destroying the casing, using a low-viscosity resin that is cast around the microcircuit and security element, ensuring the microcircuit is inaccessible and the security element is irreversibly associated with the carrier.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a transparent protective shell is used to enclose the microcircuit, then the personalization element is visible, but the security is compromised as the shell can be dismantled and the personalization element replaced
Solution Approach 1:
The patent merges the protective shell with the personalization element by molding the shell directly over the element, creating an integrated structure where the shell itself becomes part of the security feature. This eliminates the separate components that could be independently replaced, resolving the contradiction between visibility and security.
Solution Approach 2:
The personalization element is embedded into the shell during the molding process itself, before the shell is completed. This preliminary integration ensures that the element cannot be accessed or replaced without destroying the shell structure, maintaining both visibility and security.
2Ease of operation
If the microcircuit is left accessible for connection, then the device can function, but the microcircuit can be tampered with or replaced
Solution Approach 1:
The patent segments the device into two functional zones: an accessible connector region that allows connection, and an enclosed microcircuit region that provides security. The shell is molded to expose only the necessary connector portions while enclosing the microcircuit, resolving the contradiction between operational access and security.
3Strength
If a separate metal outer casing is used, then the microcircuit is protected, but the security element cannot be irreversibly associated with the carrier
Solution Approach 1:
The patent uses a composite structure combining a metal base (for strength and connector functionality) with a molded shell material (for integrated security features). The shell is formed directly over the security element, creating an irreversible association, while the metal base provides the necessary mechanical strength and connection capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced security by making it impossible to dismantle the outer casing without destroying it, thereby preventing tampering and ensuring the security element remains integral to the carrier, enhancing its authenticity and usability in secure applications.
Implementation Method 1
The molding is for example carried out by casting a resin without pressure, which makes it possible to avoid any risk of damage to the microcircuit
Implementation Method 2
forming a first one-piece part with the outer casing by molding leaving the connector free and coating the microcircuit
Data Source
Figure 1~5
Figure 6~7
AI summary
A method for producing an information medium comprising a male connector (10), a microcircuit (4) connected to the connector (10), and an external package enclosing the microcircuit (4) comprises a step for forming, by molding, a first part formed of a single piece with the external package, leaving the connector (10) free and encasing the microcircuit (4). The invention also relates to a corresponding device.