Molded Interconnect Substrate Composition for Heat Dissipation
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Solution Overview
Problem
Existing molded interconnect devices (MIDs) face limitations in thermal conductivity, mechanical strength, and manufacturing cost due to the use of polymeric materials that are difficult to plate with conductive circuit traces, hindering the development of compact, high-speed, and cost-effective electronic devices.
Innovation Solution
A substrate composed of a thermotropic liquid crystalline polymer with mineral fillers is used, achieving thermal conductivities of 1 W/m-K or more and mechanical properties like Charpy impact strength of 10 KJ/m2, tensile strength of 20 to 500 MPa, and flexural strength of 40 to 500 MPa, enabling efficient heat dissipation and structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If polymeric materials are used for the plastic substrate, then ease of manufacture is improved, but thermal conductivity deteriorates
Solution Approach 1:
The patent uses a composite material consisting of polymeric material combined with thermotropic liquid crystalline polymer and mineral filler. This composite structure allows the substrate to maintain the ease of manufacture of polymeric materials while achieving enhanced thermal conductivity (1 W/m-K or more) through the thermal conductive properties of the liquid crystalline polymer and mineral filler components.
2Ease of manufacture
If polymeric materials are used for the plastic substrate, then ease of manufacture is improved, but mechanical strength deteriorates
Solution Approach 1:
The substrate employs a composite material system where polymeric material is combined with thermotropic liquid crystalline polymer and mineral filler. The liquid crystalline polymer contributes to mechanical strength while maintaining processability, and the mineral filler further enhances structural properties, achieving both ease of manufacture and improved mechanical strength simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The polymer composition provides enhanced thermal conductivity and mechanical strength, allowing for rapid heat dissipation and improved mechanical performance in electronic devices without significant electrical conductivity loss, suitable for applications requiring compact size and high-speed operation.
Implementation Method 1
The polymer composition exhibits an in-plane thermal conductivity of about 1 W/m-K or more as determined in accordance with ASTM E1461-13
Data Source
AI summary
An electronic device is provided. The device comprises a singulated carrier portion, a substrate molded onto the singulated carrier portion, and conductive traces disposed on the substrate. The substrate comprises a polymer composition that includes a thermotropic liquid crystalline polymer, a mineral filler, wherein the polymer composition exhibits an in-plane thermal conductivity of about 1 W/m-K or more as determined in accordance with ASTM E1461-13.