Molded Interconnect Packaging for Heat Dissipation in Small ICs
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Fabricating semiconductor packages that meet heat dissipation, reliability, and footprint requirements is challenging due to the limitations of existing electrical coupling techniques.
Innovation Solution
The use of a molded interconnect with embedded interconnects that electrically couple bond pads of a semiconductor die to leads, allowing for a smaller package footprint and improved thermal management by increasing the cross-sectional area of connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional wire bonds are used to electrically couple bond pads to leads, then the package footprint increases, but the heat dissipation capability is insufficient
Solution Approach 1:
The patent replaces traditional mechanical wire bonding with a molded interconnect system where conductive material is embedded within a mold compound to create electrical connections. This substitution eliminates the need for separate wire bonds and enables larger cross-sectional area connections that improve heat dissipation while reducing package footprint.
Solution Approach 2:
The patent uses a composite structure consisting of a mold compound matrix with embedded conductive interconnects. This composite material approach allows the interconnects to provide both electrical connection and thermal management functions simultaneously, resolving the contradiction between heat dissipation and package size.
2Temperature
If the cross-sectional area of connections is increased to improve heat dissipation, then the package complexity increases, but the manufacturing process becomes more challenging
Solution Approach 1:
The patent merges the electrical interconnection function and thermal management function into a single molded interconnect structure. By combining these functions into one integrated component formed through molding, the patent achieves large cross-sectional area connections for improved heat dissipation without proportionally increasing manufacturing complexity.
Solution Approach 2:
The patent changes the physical state and form of the interconnect from discrete wire bonds to embedded conductive structures within a mold compound. This parameter change enables the interconnects to be formed with larger cross-sectional areas optimized for heat dissipation while being manufactured through a standardized molding process.
3Reliability
If multiple dies are electrically coupled through the molded interconnect, then the interconnect system complexity increases, but the electrical coupling reliability improves
Solution Approach 1:
The molded interconnect structure is designed with universal functionality to support multiple dies and provide both electrical connection and thermal management. This multi-functional design enables reliable electrical coupling of multiple dies through a standardized interconnect system without proportionally increasing system complexity.
Data Source
AI summary
A semiconductor package contains a first semiconductor die, electrically coupled to a plurality of leads around a perimeter of the semiconductor package via a molded interconnect. The molded interconnect comprises a plurality of embedded interconnects in a first mold compound which electrically couple the plurality of bond pads of the first semiconductor die to the plurality of leads of the semiconductor package. The molded interconnect may have a greater cross-sectional area at a given pitch compared to a similar wire bonded semiconductor package and allow advantageous thermal management of the semiconductor package compared to other electrical coupling techniques. The molded interconnect may allow small high-power integrated circuits to be packaged with a package footprint which is smaller than would otherwise be available.