Injection Molded Interconnect Housing for Wearable Signal Integrity
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Solution Overview
Problem
Challenges exist in packaging electronic components in wearable devices due to the presence of moisture and contaminants, which can affect signal integrity and device reliability.
Innovation Solution
A conductive injection molded interconnect system with a printed flexible substrate using a two-shot injection molding process to create a stiffener with conductive posts and bumps, ensuring electrical connectivity and mechanical stability, while minimizing signal loss and interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional packaging methods are used in wearable devices, then assembly flexibility is maintained, but signal integrity deteriorates due to moisture and contaminants
Solution Approach 1:
The patent merges the packaging housing and electrical interconnect functions into a single integrated component. The injection molded housing incorporates conductive posts and conductive bumps that directly provide electrical connections between electrodes and electronic components, eliminating the need for separate packaging and wiring assemblies. This integration protects signals from moisture and contaminants while maintaining structural simplicity.
Solution Approach 2:
The patent employs composite materials by incorporating conductive fillers into the polymer housing material. The housing is made from a composite of insulating polymer matrix and conductive particles or fibers, creating regions with different electrical properties. This allows the housing to simultaneously provide mechanical protection and electrical connectivity without requiring additional conductive components.
2Productivity
If external wires and manual assembly are used, then electrical connectivity is achieved, but manufacturing time increases
Solution Approach 1:
The patent performs preliminary action by pre-forming the conductive interconnect paths during the injection molding process itself. The conductive posts and bumps are created as integral features of the housing mold, establishing electrical connections before final assembly. This eliminates the need for subsequent manual wiring or assembly steps, significantly reducing manufacturing time while maintaining ease of production through standard molding processes.
3Reliability
If conductive posts are added to the housing, then electrical connectivity is improved, but manufacturing complexity increases
Solution Approach 1:
The patent applies parameter changes by modifying the electrical conductivity parameter of the housing material in specific regions. Through injection molding technology, the viscosity, temperature, or material composition parameters are adjusted during different stages of the molding process to create conductive zones within the otherwise insulating housing. This allows conductive posts and bumps to be formed as integral features without requiring separate manufacturing steps or complex multi-material assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides reliable electrical connectivity and signal integrity in wearable devices by integrating conductive posts and bumps, reducing the need for external wires and manual assembly, and ensuring mechanical stability and environmental protection.
Implementation Method 1
The conductive post and the plurality of support posts are formed of different materials. In some implementations, the conductive post includes a conductive polymer molded over the base portion.
Data Source
AI summary
An electronic device is disclosed. The electronic device can include a wearable interface having a first electrode and a second electrode spaced apart from the first electrode. The first electrode and the second electrode can be electrically connected by conductive traces. The electronic device can also include a first housing coupled to the wearable interface. The first housing can be coupled to an electronic component of the electronic device. The first housing can include a conductive bump configured to electrically contact the conductive traces. The first housing can also include a conductive post in electrical communication with the conductive bump. The conductive post can provide an electrical connection between a terminal of the electronic component and the first electrode and the second electrode.