Molded Interconnection Substrate for Ultra-Thin SIP Packages

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Solution Overview

Problem

Current system in package (SIP) technologies face challenges in integrating active and passive components efficiently, particularly in achieving lower costs, smaller sizes, and better performance for wearable, mobile, and IoT devices, with bottlenecks in the Outsourced Assembly and Test (OSAT) process such as lengthy cycle times and high equipment costs due to the through mold via (TMV) process.

Innovation Solution

A molded interconnection substrate system that integrates active and passive components with redistribution layers and pre-prepared through mold via openings for solder balls, reducing the need for expensive laser ablation and bottom molding processes, and utilizing an epoxy molding compound for improved heat dissipation and electrical performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional through mold via (TMV) process with laser ablation is used, then electrical connections between top and bottom sides are achieved, but manufacturing cost and cycle time increase significantly

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidmanufacturing cycle time

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The patent applies preliminary action by pre-forming through-mold via openings and placing solder balls before the final molding process. The solder balls are positioned in the through-mold via openings on the bottom side of the molding compound before encapsulation, eliminating the need for post-molding laser ablation and solder ball placement, thus reducing cycle time while maintaining connection reliability

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent replaces the traditional laser ablation process with a mechanical punching or drilling method to create through-mold via openings. This mechanical approach is faster and more cost-effective than laser ablation while achieving the same electrical connection function through the molding compound

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Adaptability or versatility

If traditional ETS substrate with bottom molding process is used, then component integration is achieved, but device thickness increases

Engineering Contradiction:

Improvecomponent integration capabilityVSAvoidpackage thickness

Core Design Contradiction:

Adaptability or versatilityVSLength of stationary object

Solution Approach 1:

The patent transitions from a traditional planar ETS substrate architecture to a three-dimensional molded interconnection substrate architecture. By forming through-mold via openings that extend vertically through the molding compound and placing solder balls within these openings, the patent achieves component integration in the Z-dimension (thickness direction) rather than only in the planar X-Y dimensions, enabling ultra-thin package profiles while maintaining integration capability

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent applies the nested doll principle by placing solder balls inside the through-mold via openings formed within the molding compound. The solder balls are nested within the cavities created by the through-mold via openings, allowing electrical connections to be formed within the package structure itself rather than requiring additional external connection layers, thus reducing overall package thickness

Inventive Principle:

Principle #7Nested doll (Nesting)

3Manufacturing precision

If expensive laser ablation equipment is used for TMV process, then through mold via openings are formed, but manufacturing cost increases

Engineering Contradiction:

Improvevia opening precisionVSAvoidmanufacturing cost

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent replaces expensive, complex laser ablation equipment with simpler, more cost-effective mechanical punching or drilling tools. These mechanical tools provide sufficient precision for forming through-mold via openings without the high equipment costs and operational expenses associated with laser systems, making the manufacturing process more economically viable while maintaining adequate via opening precision

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent substitutes the optical laser ablation system with a mechanical punching or drilling system. This mechanical approach uses physical force to create through-mold via openings rather than using laser energy to vaporize material, resulting in lower equipment costs, reduced operational complexity, and decreased manufacturing expenses while achieving comparable via opening precision through optimized mechanical tool design

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS11251132B1Integrated type MIS substrate for thin double side SIP package

Publication Date: 2022.02.15 DIALOG SEMICONDUCTOR (UK) LTD

AI summary

A molded interconnection substrate system in package is achieved comprising a molding compound having redistribution layers therein, at least one first active or passive component mounted on one side of the molded interconnection substrate and embedded in a top molding compound, at least one second active or passive component mounted in a cavity on an opposite side of the molded interconnection substrate wherein electrical connections are made between the at least one first active or passive component and the at least one second active or passive component through the redistribution layers and solder balls mounted in openings in the molded interconnection substrate to the redistribution layers wherein the solder balls provide package output.