Power Module Metal Substrate With Molded Isolation and Press-Fit Connectors
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Solution Overview
Problem
The high cost of producing semiconductor power modules with DCB substrates is driven by material costs and complex processing steps, necessitating a more cost-effective approach without compromising performance.
Innovation Solution
A method using a planar sheet metal substrate with channels forming islands, encapsulated by a molded body, and press-fit connectors for a semiconductor power module, which reduces processing steps and material costs while maintaining performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If DCB substrate with ceramic insulating layer and copper metallization layer is used, then electrical isolation and conductivity are achieved, but material cost and processing complexity increase
Solution Approach 1:
The patent extracts the essential function of electrical isolation from the complex DCB substrate structure. Instead of using ceramic insulating layers with copper metallization, the invention uses a simple plastic molded body that provides electrical isolation while the metal substrate provides conductivity. This extracts the isolation function from the complex multi-layer structure and implements it through a simpler single-material approach.
Solution Approach 2:
The patent applies homogeneity by using a uniform plastic material for the molded body that provides both structural support and electrical isolation. Instead of heterogeneous DCB substrate with different materials (ceramic, copper, adhesive), the invention uses homogeneous plastic material that simplifies the structure while maintaining the required electrical isolation properties.
2Reliability
If DCB substrate with multiple processing steps including bonding and riveting is used, then substrate performance is achieved, but production time and cost increase
Solution Approach 1:
The patent merges multiple separate processing steps into a single injection molding operation. Instead of separately bonding copper layers to ceramic, riveting connectors, and assembling components, the invention combines all these functions into one molded body that is formed in a single processing step, dramatically improving production efficiency.
Solution Approach 2:
The patent applies preliminary action by forming all structural features, including recesses for connectors and channels for fluid flow, directly during the injection molding process. This eliminates the need for subsequent secondary operations such as drilling, riveting, or bonding, as all features are prepared in advance during the molding process itself.
3Reliability
If conventional DCB substrate materials and processing are used, then module performance is maintained, but material and processing cost increase
Solution Approach 1:
The patent replaces expensive DCB substrate materials (ceramic and copper) with a cheaper plastic molded body. While traditional DCB substrates use costly materials, the invention uses inexpensive plastic material that can be mass-produced through injection molding, significantly reducing material and processing costs while maintaining functional performance.
Data Source
AI summary
A power semiconductor module includes a substrate of planar sheet metal including a plurality of islands that are each defined by channels that extend between upper and lower surfaces of the substrate, a first semiconductor die mounted on a first one of the islands, a molded body of encapsulant that covers the metal substrate, fills the channels, and encapsulates the first semiconductor die, a hole in the molded body that extends to a recess in the upper surface of the substrate, and a press-fit connector arranged in the hole such an interior end of the press-fit connector is mechanically and electrically connected to the substrate.