Molded Lead Frame Connector for Optical Transceivers
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Solution Overview
Problem
Conventional methods for connecting optical sub-assemblies to printed circuit boards in optical transceiver modules are costly, prone to signal reflection, and risk damaging fragile components, especially in high-speed applications where impedance matching is critical.
Innovation Solution
The use of lead frame connectors with a conductive structure encased in molded plastic casings, incorporating passive components like resistors, capacitors, and inductors to ensure impedance matching and reduce signal reflection, which can be easily surface-mounted onto printed circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If flex circuits are used to connect optical sub-assemblies to PCB, then good electrical performance and impedance matching are achieved, but manufacturing costs and labor requirements increase significantly
Solution Approach 1:
The patent combines the connector structure with passive components (resistors, capacitors, inductors) into a single integrated lead frame assembly. This merging eliminates the need for separate flex circuits while maintaining impedance matching capabilities, thereby reducing manufacturing complexity and cost without sacrificing electrical performance.
Solution Approach 2:
The lead frame connector is designed to serve multiple functions: it provides mechanical support, electrical connection, impedance matching, and signal termination all in one component. By making the connector multi-functional, the patent eliminates the need for additional dedicated flex circuits, reducing both manufacturing cost and assembly complexity while maintaining reliable electrical performance.
2Ease of manufacture
If leads of TOSAs and ROSAs are bent for direct connection to PCB, then manufacturing cost decreases, but reliability decreases due to risk of damaging glass seals and fragile portions
Solution Approach 1:
The patent introduces a lead frame connector as an intermediary component between the optical sub-assemblies and the PCB. This mediator absorbs the mechanical stress and positioning requirements, allowing the fragile TOSAs and ROSAs to remain intact while still achieving reliable connection to the PCB without requiring lead bending.
3Productivity
If leads are bent for direct PCB connection, then labor costs decrease, but radio frequency response deteriorates due to inability to control impedances
Solution Approach 1:
The patent incorporates passive components (resistors, capacitors, inductors) into the lead frame connector to actively control and adjust impedance parameters. This allows precise RF performance optimization while maintaining simple assembly processes, achieving both high productivity and reliable RF response that cannot be obtained through lead bending alone.
4Reliability
If passive components are added to the lead frame connector for impedance matching, then signal reflection is reduced, but device complexity increases
Solution Approach 1:
The patent merges passive components directly into the lead frame connector structure, creating an integrated assembly rather than separate discrete components. This combining approach reduces the overall system complexity by eliminating additional mounting steps and components while maintaining the signal quality improvements provided by impedance matching.
Data Source
AI summary
Exemplary embodiments of the present invention illustrate lead frame connectors for connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors include a conductive lead structure that is encased in a plurality of polymer casings. The polymer casings provide electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. One or more passive components can mount to the conductors of the lead frame connector to aid with impedance matching between an optical sub-assembly, the lead frame connector, and the printed circuit board. The lead frame connectors connect to the leads associated with the optical sub-assemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical sub-assembly and the printed circuit board.