Molded Leadframe Package With Insulating Zone Covering

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Solution Overview

Problem

Current semiconductor device packaging methods are costly and lack reliability and versatility, particularly in creating efficient electrical connections to external circuitry, which limits the performance and cost-effectiveness of electronic devices.

Innovation Solution

The use of a molded leadframe package with an electrically insulating encapsulant and a covering layer that defines input/output terminal contacts, allowing for flexible geometry and improved electrical connectivity without the need for complex shaping of the leadframe, and the application of metal plating layers to enhance soldering and protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If traditional semiconductor packaging methods are used, then manufacturing cost is high, but the patent aims to reduce manufacturing cost through simplified leadframe design and molding process

Engineering Contradiction:

Improvemanufacturing costVSAvoidelectrical connection reliability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The leadframe is divided into distinct functional zones: a first zone with first terminal contacts for electrical connection and a second zone with second terminal contacts for other functions. This segmentation allows each zone to be optimized independently, simplifying the overall design while maintaining reliable electrical connections through the specialized first terminal contacts.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

An electrically conductive coating is applied to the first terminal contacts to serve as an intermediary layer that enhances solderability and ensures reliable electrical connection between the leadframe and external circuitry, thereby improving connection reliability without complicating the manufacturing process.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If complex leadframe shaping is used to define terminal contacts, then electrical connectivity is improved, but device complexity increases

Engineering Contradiction:

Improveelectrical connectivityVSAvoidleadframe geometry complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The leadframe is segmented into distinct zones with different terminal contact configurations. The first zone contains first terminal contacts specifically designed for electrical connection to the semiconductor chip, while the second zone contains second terminal contacts for other functions. This segmentation enables clear functional differentiation without requiring complex overall leadframe geometry.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the leadframe are given different properties: the first terminal contacts in the first zone are provided with an electrically conductive coating to enhance solderability and electrical connection, while other regions maintain their base properties. This local differentiation achieves improved electrical connectivity without requiring complex shaping throughout the entire leadframe structure.

Inventive Principle:

Principle #3Local quality

3Adaptability or versatility

If more terminal contacts are provided for external connection, then adaptability is improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improveexternal connection versatilityVSAvoidterminal contact definition precision

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The leadframe is divided into multiple zones with different terminal contacts (first terminal contacts and second terminal contacts), enabling versatile external connections for different functions. Each zone can be independently optimized and manufactured, reducing the overall precision requirements compared to manufacturing all terminal contacts with uniform high precision.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The electrically conductive coating is applied specifically to the first terminal contacts that require enhanced solderability, rather than coating the entire leadframe. This partial application achieves the necessary adaptability for external connections while reducing manufacturing complexity and precision requirements compared to full-surface treatment.

Inventive Principle:

Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces manufacturing costs, enhances the reliability and versatility of semiconductor device packages by enabling efficient electrical connections and precise definition of terminal contacts, improving the overall performance and yield of electronic devices.

Implementation Method 1

a molded encapsulant configured to embed the semiconductor chip and cast-in-place the leadframe

Methodology Applied

Scientific EffectEncapsulation: Physical Containment

Implementation Method 2

the application of metal plating layers to enhance soldering and protection

Methodology Applied

Scientific EffectMetal plating: Electroplating

Data Source

PatentUS9728493B2Mold PackageD semiconductor chip mounted on a leadframe and method of manufacturing the same

Publication Date: 2017.08.08 INFINEON TECHNOLOGIES AG

AI summary

A semiconductor device package includes a leadframe and a semiconductor chip mounted to the leadframe. The semiconductor device package further includes a molded encapsulant configured to cast-in-place the leadframe. A surface area of the leadframe remains exposed by the encapsulant. An electrically insulating covering layer extends over a part of the surface area and is configured to divide the surface area in at least two zones.