Molded Matrix Panel for Electronic Module Sealing
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Solution Overview
Problem
Existing electronic packaging techniques, such as the optical land grid array (OLGA) package, face issues with contamination, adhesive overflow, and misalignment due to air vents and complex manufacturing processes, which affect the reliability and performance of camera modules.
Innovation Solution
The method involves molding a matrix panel with cavities onto a substrate, attaching semiconductor dies, electrically connecting them, and affixing a cover with glue drain grooves to prevent adhesive overflow and misalignment, then separating the modules using a carrier tape, which reduces contamination risks and simplifies the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an air vent is provided in the OLGA package to permit outgassing from adhesive, then adhesive outgassing is enabled, but contamination can enter the cavity through the air vent
Solution Approach 1:
The patent removes the air vent feature from the package design. Instead of providing an opening for outgassing that risks contamination, the invention uses a completely sealed cavity structure where adhesive outgassing is managed without requiring any vents or openings in the package housing.
Solution Approach 2:
The sealed cavity creates a protected environment that isolates the semiconductor die from external contamination. The adhesive is applied in a controlled manner and the cavity is sealed before full curing, creating an inert-protected space that prevents contaminants from entering while allowing adhesive to outgas internally.
2Strength
If adhesive is used for attaching the glass cover to the structural element, then the glass cover is secured, but adhesive can overflow into the cavity and cause misalignment
Solution Approach 1:
The cavity is sealed before the adhesive is fully applied and cured. This preliminary sealing action creates a contained environment that prevents adhesive overflow onto the glass cover, ensuring proper alignment while still achieving strong attachment. The seal is formed in advance to prevent the harmful effect of adhesive misalignment.
Solution Approach 2:
The adhesive is applied in a controlled, localized manner within the sealed cavity environment. The sealing structure creates different zones: a controlled adhesive application zone that prevents overflow, and a separate glass cover mounting zone that remains free of adhesive contamination, ensuring precise alignment.
3Reliability
If the OLGA package process is followed, then electronic components are packaged, but the manufacturing process is relatively complex
Solution Approach 1:
The patent combines multiple OLGA package steps into a more integrated process. The cavity sealing, adhesive application, and glass cover attachment are performed in a streamlined sequence that reduces the number of separate manufacturing operations while maintaining packaging reliability.
Solution Approach 2:
The manufacturing process is segmented into distinct, manageable stages: cavity preparation and sealing, semiconductor die mounting, adhesive application within the sealed cavity, and glass cover attachment. This segmentation allows each step to be optimized independently, reducing overall process complexity while maintaining high reliability.
Data Source
AI summary
A method is described for making electronic modules includes molding onto a substrate panel a matrix panel defining a plurality of cavities, attaching semiconductor die to the substrate panel in respective cavities of the molded matrix panel, electrically connecting the semiconductor die to the substrate panel, affixing a cover to the molded matrix panel to form an electronic module assembly, mounting the electronic module assembly on a carrier tape, and separating the electronic module assembly into individual electronic modules. An electronic module is described which includes a substrate, a wall member molded onto the substrate, the molded wall member defining a cavity, at least one semiconductor die attached to the substrate in the cavity and electrically connected to the substrate, and a cover affixed to the molded wall member over the cavity.