Modular Molded Memory Assemblies for Replaceable SiP Packages
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Solution Overview
Problem
Semiconductor package assemblies, particularly System in Package (SiP) devices, face challenges with high yield loss due to the inaccessibility of individual semiconductor devices once encapsulated in a molded casing, making troubleshooting, replacement, and upgrading impossible without replacing the entire package.
Innovation Solution
The implementation of individually accessible and replaceable molded die assemblies within the semiconductor package, allowing for separate encapsulation of memory components like NAND stacks and DRAM dies, enabling individual testing, replacement, and upgrading without replacing the entire package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor devices are encapsulated in a molded casing for protection, then reliability and protection from damage is improved, but accessibility for troubleshooting, replacement, and upgrading deteriorates
Solution Approach 1:
The patent divides the semiconductor package into separate modular assemblies, where each semiconductor device is individually encapsulated in its own molded casing rather than being enclosed in a single unified package. This segmentation allows individual devices to be accessed, removed, or replaced independently while maintaining protection through their respective enclosures.
2Reliability
If semiconductor devices are encapsulated in a molded casing, then protection from damage is improved, but ease of repair and replacement deteriorates
Solution Approach 1:
By segmenting the package into separate modular assemblies with individually encapsulated devices, the patent enables repair technicians to access and replace only the specific faulty component without needing to open or replace the entire package, thereby improving ease of repair while maintaining protection.
Solution Approach 2:
The patent creates a dynamic repair system where the package configuration allows for post-manufacturing modifications, including the addition, removal, or replacement of individual semiconductor devices, transforming the package from a static sealed unit to a dynamically reconfigurable assembly.
3Reliability
If semiconductor devices are encapsulated in a molded casing, then protection is improved, but adaptability for upgrading deteriorates
Solution Approach 1:
The modular segmented structure allows different semiconductor devices to be independently upgraded by replacing individual assemblies with newer versions, maintaining protection while enabling technological advancement and adaptability.
Solution Approach 2:
The patent creates universal modular assemblies that can be interchanged and configured in different arrangements, allowing the same base structure to support multiple device types and configurations, thereby enhancing adaptability for different applications and future upgrades.
4Reliability
If entire package is replaced due to faulty component, then reliability is maintained, but productivity and yield loss deteriorates
Solution Approach 1:
By segmenting the package into replaceable modular assemblies, the patent eliminates the need to replace the entire package when a single component fails, thereby improving productivity by reducing waste and manufacturing costs while maintaining the reliability of the functional system.
Data Source
AI summary
Implementations described herein relate to various semiconductor device assemblies. In some implementations, a molded memory device may include multiple stacked NAND dies electrically coupled to one another via multiple wire bonds. The molded memory device may include a molded casing surrounding the multiple stacked NAND dies and encapsulating the multiple wire bonds, with the molded casing including a first mold surrounding a first portion of a first NAND die, of the multiple stacked NAND dies, and a second mold partially surrounding a second portion of the first NAND die and each additional NAND die, of the multiple NAND dies. The molded memory device may include multiple copper contacts configured to couple the molded memory device to a substrate associated with a system in package, with the plurality of copper contacts being disposed in the first mold.