Semiconductor Packaging with Molded Metal-Plastic Isolator
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Solution Overview
Problem
Current high power RF semiconductor packages face challenges with expensive ceramic insulators and polymer-based packages that have reliability issues due to weak polymer/metal interfaces and mechanical failures, especially under new lead-free and RoHS requirements.
Innovation Solution
A semiconductor packaging system where a metal element is molded into a plastic to form a base for an electrical isolator structure, allowing solder attachment to a substrate, reducing costs and improving mechanical robustness, and using less expensive plastic materials while enhancing adhesion through mold locking features.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ceramic insulators are used in high power RF semiconductor packages, then reliability and mechanical tolerance are improved, but manufacturing cost increases
Solution Approach 1:
The patent changes the material parameter from ceramic to polymer, and modifies the joining method from brazing/soldering to molding. This parameter change achieves cost reduction while maintaining reliability through the creation of a metal-insulator plastic composite structure that eliminates the need for expensive ceramic materials and complex brazing processes.
Solution Approach 2:
The patent creates a composite material structure by molding metal elements directly into the polymer insulator material. This composite approach (metal-insulator plastic) combines the advantages of both materials: the electrical conductivity and mechanical strength of metal with the cost-effectiveness and moldability of polymer, eliminating the need for separate ceramic components.
2Ease of manufacture
If polymer insulators are used in high power RF semiconductor packages, then manufacturing cost is reduced, but mechanical strength and interface reliability deteriorate
Solution Approach 1:
The patent merges the metal insulator support and the polymer insulator into a single integrated structure through molding. The metal elements are embedded directly into the polymer matrix, creating a unified component that eliminates the separate polymer/metal interface that previously caused reliability problems. This merging ensures strong mechanical bonding and consistent electrical performance.
3Productivity
If the package is completed before chip attachment, then manufacturing efficiency is improved, but mechanical reliability and chip attach options deteriorate
Solution Approach 1:
The patent segments the manufacturing process into distinct stages: first forming the metal-insulator plastic composite structure, then separately attaching the chip to the substrate, and finally assembling these pre-prepared components. This segmentation allows each component to be optimized independently and assembled with proper alignment, improving both reliability and manufacturing flexibility.
Solution Approach 2:
The patent performs preliminary actions by pre-forming the metal-insulator plastic composite structure with embedded leads and support elements before chip attachment. This preliminary preparation ensures proper positioning and mechanical strength are established beforehand, allowing high-temperature chip attachment processes to proceed without compromising package integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a cost-effective and reliable high power RF semiconductor package with improved mechanical integrity and reduced solder run-out issues, enabling the use of various lower-cost plastic materials and allowing high-temperature chip attachment processes.
Implementation Method 1
a metal element is molded into a plastic to form a base of an electrical isolator structure
Implementation Method 2
enhancing adhesion through mold locking features
Implementation Method 3
allowing solder attachment to a substrate
Data Source
AI summary
A semiconductor structure (100, 900) includes a substrate (110) having a surface (111) and also includes one or more semiconductor chips (120) located over the substrate surface. The semiconductor structure further includes an electrical isolator structure (340) located over the substrate surface, where the electrical isolator structure includes one or more electrical leads (341, 342) and an organic-based element (343) molded to the electrical leads. The semiconductor structure also includes a solder element (350) coupling together the electrical isolator structure and the substrate surface.