Molded Microfluidic Substrate Using Sacrificial Wire Bonding
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Solution Overview
Problem
The high cost of manufacturing microfluidic devices with three-dimensional (3D) microfluidic channels limits their widespread adoption, as existing methods like photolithographic deposition and molded interconnect substrate (MIS) processes are expensive.
Innovation Solution
A novel molding process using wire bonding techniques to attach sacrificial metal bond wires to a metal bond layer, encase them in a molding compound, and etch them away to create 3D microfluidic channels, which is less expensive and allows for metal-coated channels without additional fabrication steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photolithographic deposition or molded interconnect substrate processes are used to create 3D microfluidic channels, then manufacturing precision and channel complexity are improved, but manufacturing cost increases significantly
Solution Approach 1:
The patent introduces a sacrificial metal bond wire as an intermediary element that is temporarily placed within the molding compound to define the future microfluidic channel pathway. This sacrificial wire serves as a mediator between the molding process and the final channel structure, allowing complex 3D channels to be formed through a simpler wire bonding process rather than expensive photolithographic deposition. The sacrificial wire is later removed to reveal the desired channel geometry.
Solution Approach 2:
The patent employs a disposable sacrificial metal bond wire that is intentionally designed to be temporary and low-cost. This sacrificial element is placed during manufacturing to define channel geometry, then deliberately removed through etching to create the final microfluidic channel. The use of this temporary, inexpensive sacrificial component replaces the need for expensive precision manufacturing processes while achieving the same 3D channel complexity.
2Ease of manufacture
If traditional molding processes are used, then manufacturing cost is reduced, but the ability to create complex 3D microfluidic channels and metal-coated channels is limited
Solution Approach 1:
The patent transitions from planar 2D wire bonding to three-dimensional channel formation by allowing the sacrificial metal bond wire to be positioned and oriented in 3D space within the molding compound. The wire can be bent and shaped to create complex three-dimensional channel geometries that extend in multiple directions and depths, enabling the molding process to produce sophisticated 3D microfluidic structures rather than simple flat channels.
Solution Approach 2:
The patent makes the wire bonding process multi-functional by having the sacrificial metal bond wire serve dual purposes: first as an electrical interconnect during device assembly, and second as a template for defining the microfluidic channel pathway. After the sacrificial wire is removed, the original wire bonding locations are restored through re-bonding, allowing the same process to create both electrical connections and fluidic channels without requiring separate fabrication steps.
3Ease of manufacture
If wire bonding techniques with sacrificial metal are used, then manufacturing cost decreases and 3D channel capability is achieved, but additional etching steps are required
Solution Approach 1:
The patent merges multiple functions into the wire bonding process itself. The sacrificial metal bond wire simultaneously serves as the electrical interconnect during device assembly and as the template that defines the microfluidic channel geometry. This consolidation allows the same manufacturing step to create both the electrical connection and the channel pathway, reducing the need for separate fabrication processes despite requiring an etching step for channel formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This process significantly reduces manufacturing costs while enabling the production of cost-effective 3D microfluidic substrates with metal-plated channels, overcoming the expense of traditional methods.
Implementation Method 1
etching away the sacrificial metal bond wire to yield the microfluidic substrate having the microfluidic channel formed within the molding compound layer and corresponding to the etched-away sacrificial metal bond wire
Data Source
AI summary
A molded microfluidic substrate includes a molding compound layer. The molded microfluidic substrate includes a microfluidic channel. The microfluidic channel of the molded microfluidic substrate is formed within the molding compound layer of the molded microfluidic substrate. The microfluidic channel of the molded microfluidic substrate corresponds to a sacrificial metal bond wire.