Molded Module Package With Open-Cell EMI Shielding Barrier
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Solution Overview
Problem
Existing IC packages face challenges in minimizing thickness due to the use of expensive metal lids or metallic coatings for EMI shielding, which require additional assembly processes and have limitations in shielding performance.
Innovation Solution
The use of a radiation barrier made from open-cell metal foam material, such as copper, aluminum, or nickel, disposed over the die and wire bonds, which is encapsulated by a mold compound, providing effective EMI shielding while maintaining a compact package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal lid is used for EMI shielding, then EMI shielding effectiveness is improved, but package thickness increases and manufacturing cost increases
Solution Approach 1:
The patent uses a porous radiation barrier material that allows electromagnetic radiation to be absorbed or blocked while maintaining a thin profile. The porous structure provides large surface area for EMI shielding interaction without requiring thick material, thus achieving effective EMI shielding while minimizing package thickness increase.
Solution Approach 2:
The radiation barrier is formed as a composite structure comprising intermixed metal particles and ceramic particles. This composite material provides effective EMI shielding through the metal particles while the ceramic particles provide structural stability and thermal resistance, achieving good EMI shielding performance in a thin layer without requiring expensive metal lids.
2Object-affected harmful factors
If a metal lid is used for EMI shielding, then EMI shielding effectiveness is improved, but manufacturing cost increases
Solution Approach 1:
The radiation barrier uses a composite of metal particles and ceramic particles that can be applied as a thin layer through conventional printing or deposition techniques. This composite material provides effective EMI shielding at a fraction of the cost of metal lids, while being compatible with existing manufacturing processes.
Solution Approach 2:
The radiation barrier is formed as a thin, disposable layer that can be applied directly to the substrate or package structure. This eliminates the need for expensive, reusable metal lids and complex assembly processes, significantly reducing manufacturing cost while maintaining effective EMI shielding.
3Object-affected harmful factors
If metallic coating material is used for EMI shielding, then EMI shielding performance is improved, but additional assembly processes are required and manufacturing cost increases
Solution Approach 1:
The radiation barrier is integrated directly into the package structure or substrate, combining the EMI shielding function with the existing package components. This eliminates the need for separate metal lids or coating processes, reducing assembly complexity while maintaining effective EMI shielding performance.
Solution Approach 2:
The intermixed metal and ceramic particles in the radiation barrier create a material that can be applied in a single step using conventional techniques. This composite structure provides both EMI shielding and structural functions, eliminating the need for multiple assembly processes required by metallic coatings.
4Object-affected harmful factors
If metal lid or metallic coating is used for EMI shielding, then EMI shielding is achieved, but thermal insulation performance deteriorates
Solution Approach 1:
The radiation barrier uses a composite of metal particles and ceramic particles where the ceramic particles provide thermal insulation properties. This composite structure achieves effective EMI shielding through the metal particles while the ceramic matrix provides thermal resistance, simultaneously achieving both EMI shielding and thermal insulation performance.
Solution Approach 2:
The porous structure of the radiation barrier provides thermal insulation by trapping air or gas in the pores, which are poor thermal conductors. This porous metal-ceramic composite achieves EMI shielding through the conductive metal particles while the porous structure and ceramic material provide thermal insulation, preventing heat transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The open-cell metal foam radiation barrier enhances EMI shielding effectiveness, reduces package thickness, and improves thermal insulation, all while being cost-effective and compatible with molded packages.
Implementation Method 1
A radiation barrier is attached to the substrate and disposed over the die. The radiation barrier is configured to mitigate electromagnetic radiation exposure to the die.
Implementation Method 2
The open-cell metal foam radiation barrier enhances EMI shielding effectiveness, reduces package thickness, and improves thermal insulation
Data Source
AI summary
An electronic device that includes a substrate and a die disposed on the substrate, the die having an active surface. Wire bonds are attached from the active surface of the die to the substrate. A radiation barrier is attached to the substrate and disposed over the die. The radiation barrier is configured to mitigate electromagnetic radiation exposure to the die. A mold compound is formed over the die, the wire bonds, and the radiation barrier.