Molded Device Package Aperture Design for Smaller Sensor Packages
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Solution Overview
Problem
Previous methods of forming molded packages with openings for devices like optical sensors using film-assisted molding processes require a minimum clearance between components and molding material, limiting the minimum package size due to the need for a barrier to prevent molding material from covering sensitive components.
Innovation Solution
The method involves encapsulating the edges of a component with a filler material to form flat surfaces, allowing a mold insert to contact these surfaces during molding, which reduces the minimum clearance needed and enables smaller package dimensions by exposing a portion of the component's top surface through an aperture defined by the filler material's positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If film-assisted molding processes are used to create molded packages with openings, then components can be protected from damage, but a minimum clearance is required between components and molding material which limits the minimum package size
Solution Approach 1:
A mold insert acts as an intermediary tool during the molding process. The insert is brought into contact with the substantially flat surfaces of the encapsulated areas and maintains contact throughout the molding operation, allowing the molding material to be deposited without requiring excessive clearance around the component. This intermediary structure enables precise control over the aperture formation while minimizing the overall package volume.
Solution Approach 2:
The edges of the component are pre-encapsulated with filler material to create substantially flat surfaces before the main molding process. This preliminary encapsulation establishes defined reference surfaces that the mold insert can contact, allowing for precise positioning and reducing the clearance needed during subsequent molding operations. The aperture dimensions are predetermined by the positioning of these pre-formed encapsulated surfaces.
2Manufacturing precision
If a barrier is used to prevent molding material from covering sensitive components, then component exposure is controlled, but the package dimensions increase due to the required clearance
Solution Approach 1:
The mold insert serves as a mediator that defines the aperture boundaries during molding. By contacting the pre-formed encapsulated surfaces, the insert precisely controls where the molding material stops, ensuring sensitive components remain exposed only in the intended aperture areas without requiring excessive clearance zones around the component.
Solution Approach 2:
The invention changes the approach from using a continuous barrier film to using discrete encapsulated surfaces with specific geometric parameters. The substantially flat surfaces created by filler material encapsulation provide well-defined contact points for the mold insert, allowing precise control of aperture dimensions through parameter specification rather than relying on large clearance margins.
Data Source
AI summary
A device package is formed form a volume of molding material that encapsulates a component. Edges of the component are protected by encapsulated areas formed above the edges by a filler material prior to molding the component. The molding material also encapsulates the filler material and positioning of the filler material defines a location and dimensions of an aperture in the molding material that exposes a portion of a top surface of the component.